Modules

Akrometrix Module Options

Depending on the tasks required and the model of system, modules can be added to enhance the capability of selected systems. The Digital Image Correlation module provides non-contact surface measurement for surface strain and coefficients of thermal expansion, Digital Fringe Projection measures out of plane warpage where step height changes are present, Convection Reflow Emulation Module for improved replication of the reflow solder process heating, and the Convective Module to cool samples down to -50°C.

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The Compact X-Wing® BiLog® for RF EMC immunity testing

The combination of BiLog® technology with novel low frequency, folded elements (X-Wings®) allows low frequency power to be efficiently projected forward without significantly affecting the high frequency performance and, at the same time, reduces the chamber coupling effects. The CBL 6143 has a unique matching network which will allow powers of up to 300 Watts CW to be transmitted, making it suitable for most immunity measurements requiring fields of 10 V/m, or even greater.

Parameter Value
Frequency range 30 MHz to 3 GHz (useable to 20 MHz)
Typical gain 6 dB (200 MHz to 3 GHz) / 8 dB (700 MHz to 2.5 GHz)
Impedance (nominal) 50 Ω
Maximum continuous power 300 W
Connector N type female
  • IEC/EN 61000-4-3
  • CISPR 13
  • CISPR 14-1
  • CISPR 16-1-4
  • CISPR 16-2-3
  • CISPR 22
  • CISPR 24
  • CISPR 32
  • EN 61000-6-1
  • EN 61000-6-2
  • EN 61000-6-3
  • EN 61000-6-4
  • IEC 60533
  • IEC 60601-1-2
  • IEC 61326
  • ISO 11452-2

Teseq CBL 6143 Datasheet 

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