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Wafer Dicing Services

Proto up to Mid Volume Production

In close partnership between Accelonix and one of the leading microelectronics packaging companies in the Netherlands we are able to offer local dicing services.

With our Automatic ADT Dicing saw located in a ISO class 8 cleanroom with full auto vision and advanced alignment, our dicing engineers can very accurate singulate your substrates, wafer, PCB, QFN, and many more.

After learning your requirements, we will define the optimal dicing blade and process settings to dice your samples conform industry quality standard.

  • Single prototype production
  • Low/Medium volume production
  • High volume depending on application to be discussed.

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If you want to know more about Wafer Dicing Services
Proto up to Mid Volume Production

In close partnership between Accelonix and one of the leading microelectronics assembly companies in the Netherlands we are able to offer local dicing services.

Located in a fully equipped ISO class 8 cleanroom, our experienced dicing engineers use ADT 7200 Series Full Automatic Dicing Saws.

ADT7200 dicing Machines

Capabilities:

  • Wafer / substrate mounting on Dicing Tape
  • Full Automatic Dicing System
  • Wafers and substrates up to 8″ inch in diameter
  • Full automatic pattern recognitions for the most accurate cutting map generate.
  • High accurate axes for the highest cut quality to deliver industry standard quality
  • Atomizing Cleaning Technology
  • UV-Station for Dicing tape release.

Leading applications:

  • PCB
  • QFN
  • BGA Panels
  • Silicon Wafers
  • SAW Filters
  • LED Packages
  • Ceramic substrates
  • Thin Film Devices
  • Glass Wafers, IR Filters
  • PZT transducers
  • Many more..

Accelonix Micro Electronics Packaging Services Brochure