For over 25 years, Royce Instruments, Inc. has been an innovative global leader for design and manufacturing of precision assembly tools and high accuracy, low force bond testing equipment. Royce Instruments products include equipment for laser diode manufacturing, wire bond and die bond testing, semiconductor die pick and place into trays, waffle pack, and GelPak.
Royce Instruments equipment is utilized throughout the world by the leading semiconductor and photonics manufacturers, assembly subcontractors, computer manufacturers, aerospace companies, and most of the world’s largest auto and medical electronics device manufacturers.
Royce Instruments Die Sorters range from semi-auto table top systems to automatic high speed 300mm systems with wafer map and ink-dot die selection. Wafer map capabilities include multi-project wafers (pizza maps) and a range of industry standard wafer formats.
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