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Die Sorting

For over 25 years, Royce Instruments, Inc. has been an innovative global leader for design and manufacturing of precision assembly tools and high accuracy, low force bond testing equipment. Royce Instruments products include equipment for laser diode manufacturing, wire bond and die bond testing, semiconductor die pick and place into trays, waffle pack, and GelPak.

Royce Instruments equipment is utilized throughout the world by the leading semiconductor and photonics manufacturers, assembly subcontractors, computer manufacturers, aerospace companies, and most of the world’s largest auto and medical electronics device manufacturers.

Semi-Automatic die pick and place system.

The DE35-ST semi-automatic die pick...

DE35-ST Die Sorter

Semi-Automatic die pick and place system.

The DE35-ST semi-automatic die pick and place system is an elegantly simple, low cost machine for picking die from sawn or scribed wafers mounted on adhesive film. Die can be placed into waffle packs, Gel-Pak®, film frame or directly onto substrates. The DE35-ST eliminates the inefficiencies and down time usually found in small lot production.

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Automatic Die Handling & Sorting System

The award winning Autoplacer MP300...

MP300 Die Sorter

Automatic Die Handling & Sorting System

The award winning Autoplacer MP300 Die Sorter is specifically engineered for automatic die sort using ink dots and wafer maps, with rich support for die binning and sorting multi-project wafers (sometimes called “Pizza” wafers) with output to Waffle packs, Gel-Pak™, film frames, JEDEC trays and substrates.

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New automated die sorter

A new automated die sorter to handle the output mediums...

AP+ Automated Die Sorter

New automated die sorter

A new automated die sorter to handle the output mediums your process requires (carrier tape, waffle pack, Gel-Pak, JEDEC tray, film frame, grip ring, and custom trays).

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