Wire Bonding Services

From our demo lab in Eindhoven (NL) our experienced Application Engineers are able to offer Micoelectronics Packaging Services.

Technical advise, flexibility, quality, fast delevery and a good and long term relation with our clients are the keywords for a succesfull coorperation.

  • Product and process demonstrations
  • Single prototype production
  • Low volume production
  • Process development and trainings

With our network of equipment manufacturers and local partners we are able to offer a solution for many Micro Electronics Packaging challenges.

Quick Enquiry

If you want to know more about Wire Bonding Services

FINE WIRE BONDING SERVICES

For specialistic prototypes  to low volume production

Wedge-Wedge Bonding

  • Alumium wires
  • Gold wires

Ball – Wedge Bonding

  • Gold  wires

  

Gold Bump Bonding

  • Flip Chip technology

  

Other:

  • Ribbon bonding
  • Microwave en RF technology
  • Gold ribbon

HEAVY WIRE BONDING SERVICES

For specialistic prototypes  to low volume production

    

  • Heavy wire: 100µm – 500µm
  • Ribbon bonding
  • Tab Bonding
  • Insulated wire


High power Applications:

  • Batterypacks,  (fused wires)
  • LED’s
  • Automotive
  • Many Power Electronics
  • Many more…….
 

Accelonix has experience in the wire bonding and handling of Lithium-Ion cells used widely in Batterypacks for EHV!

 

Accelonix Micro Electronics Packaging Services Brochure