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Manual Die Bonders

Die bonding, Flip Chip Bonding, Ultrasonic Die Bonding, Eutectic Bonding. Everything is possible with TRESKY machines!

For over 30 years, Tresky has been perfecting the art of creating handling and pick & place systems.

As a solutions provider, they support specific applications with highly accurate and innovative systems.
Starting from manual to automatic, from adhesives to tools, exactly as per our customer’s need.

This is made possible by the extensive experience and modular setup which allows adapting various basic systems with countless options for new processes.

With almost one thousand devices installed across the world, often with special & customized equipment, Tresky diligently work to fulfill complex process requirements.

Supported by a fast, flexible and professional team ready to be tested, we look forward to your challenge!

The T-4909 is a manual, high quality die bonder with superior ergonomic design....

T-4909 Budget Sensitive Manual Die Bonder

The T-4909 is a manual, high quality die bonder with superior ergonomic design.

As with all of Tresky's products, the T-4909 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

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The T-3002-M is a manual, precise, high quality die bonder & component placer...

T-3002-M Manual Die Bonder

The T-3002-M is a manual, precise, high quality die bonder & component placer with superior ergonomic design and a fix die ejector needle.

As with all of Tresky’s products, the T-3002-M incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

The T-3002-M is equiped with Tresky's die ejector system for pick-up from wafer.

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The T-3000-FC3 series is Tresky’s most flexible die bonding platform. The systems...

T-3000-FC3 Manual Bonder with semi auto process capabilities

The T-3000-FC3 series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options.

As with all of Tresky’s products, the FC3 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

Together with superior ergonomics the FC3 platform is the industry’s most sophisticated system in its class.

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The T-3002-FC3 series is Tresky’s most flexible die bonding platform. The systems...

T-3002-FC3 Manual Bonder with semi auto process capabilities

The T-3002-FC3 series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options.

As with all of Tresky’s products, the FC3 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

Together with superior ergonomics the FC3 platform is the industry’s most sophisticated system in its class.

The T-3002-FC3 is equiped with Tresky's die ejector system for pick-up from wafer.

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