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Manual Die Bonders

Die bonding, Flip Chip Bonding, Ultrasonic Die Bonding, Eutectic Bonding. Everything is possible with TRESKY machines!

For over 30 years, Tresky has been perfecting the art of creating handling and pick & place systems.

As a solutions provider, they support specific applications with highly accurate and innovative systems.
Starting from manual to automatic, from adhesives to tools, exactly as per our customer’s need.

This is made possible by the extensive experience and modular setup which allows adapting various basic systems with countless options for new processes.

With almost one thousand devices installed across the world, often with special & customized equipment, Tresky diligently work to fulfill complex process requirements.

Supported by a fast, flexible and professional team ready to be tested, we look forward to your challenge!

The T-4909 is a manual, high quality die bonder with superior ergonomic design....

The T-3002-M is a manual, precise, high quality die bonder & component placer...

The T-3000-FC3 series is Tresky’s most flexible die bonding platform. The systems...

The T-3002-FC3 series is Tresky’s most flexible die bonding platform. The systems...