Heavy Wire Bonders

The Hesse Heavy Wire Bonders are  ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of substrates, chips, batterypacks, solar panels and many other materials.

These system can typically handle wires from 50 µm – 600 µm (Ribbons up to 2000 µm x 400 µm.)

The Hesse GmbH as technology leader has designed the only heavy wire bondhead with non destructive pull test and a unique transducer integrated sensor for 100% quality monitoring in real-time.

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