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Heavy Wire Bonders

The Hesse Heavy Wire Bonders are  ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of substrates, chips, batterypacks, solar panels and many other materials.

These system can typically handle wires from 50 µm – 600 µm (Ribbons up to 2000 µm x 400 µm.)

The Hesse GmbH as technology leader has designed the only heavy wire bondhead with non destructive pull test and a unique transducer integrated sensor for 100% quality monitoring in real-time.

Fully Automatic Heavy Wire Bonder

The Bondjet BJ935/939 is an ultrasonic wedge-wedge...

Best of both Technologies: ultrasonic welding & wire bonding

Hesse Mechatronics...

Best of both Technologies: ultrasonic welding & wire bonding

Hesse Mechatronics...

A Bonder for manual or automatic bonding

The Bondjet BJ653, with its changeable...

Fully Automatic Heavy Wire Bonder

Bondjets BJ955 and BJ959 of the new bonder generation...

Fully Automatic Heavy Wire Wedge Bonder with a large working area

Bondjets BJ985...