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Heavy Wire Bonders

The Hesse Heavy Wire Bonders are  ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of substrates, chips, batterypacks, solar panels and many other materials.

These system can typically handle wires from 50 µm – 600 µm (Ribbons up to 2000 µm x 400 µm.)

The Hesse GmbH as technology leader has designed the only heavy wire bondhead with non destructive pull test and a unique transducer integrated sensor for 100% quality monitoring in real-time.

A Bonder for manual or automatic bonding

The Bondjet BJ653, with its changeable...

Bondjet BJ653

A Bonder for manual or automatic bonding

The Bondjet BJ653, with its changeable bond heads, serves the wire bonding processes of wedge-wedge as well as ball-wedge and can handle fine wire, heavy wire and ribbon.

The operating methods from manual to automatic bonding is particularly appropriate for the use in laboratories, in the development and for suppliers for validating their product quality.

 

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Fully Automatic Heavy Wire Bonder

The Bondjet BJ935/939 is an ultrasonic wedge-wedge...

Bondjet BJ935/BJ939

Fully Automatic Heavy Wire Bonder

The Bondjet BJ935/939 is an ultrasonic wedge-wedge bonder developed for the fully automated processing of a wide range of substrates, chips and other materials. The system can be used as a fully automatic machine or operated manually.

The Hesse GmbH as technology leader has designed the only heavy wire bondhead with non destructive pull test and a unique transducer integrated sensor for 100% quality monitoring in real-time. Further outstanding features are high speed and the largest bonding area. Advanced features available on Bondjet BJ935/939 are designed to meet your present and future requirements and greatly enhance productivity.

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Fully Automatic Heavy Wire Bonder

Bondjets BJ955 and BJ959 of the new bonder generation...

Bondjet BJ955/BJ959

Fully Automatic Heavy Wire Bonder

Bondjets BJ955 and BJ959 of the new bonder generation are ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips and other materials. The systems can be used as a fully automatic machine or operated manually.

Hesse offers the only available solution on the market of handling wires from 50 µm up to 600 µm** with only one bondhead.

The Hesse GmbH, as technology leader, has designed the only heavy wire bondhead with a non-destructive pulltest and a unique transducer integrated sensor for 100% quality monitoring in real-time. Advanced features available on the Bondjet BJ955 and BJ959 are designed to meet your present and future requirements and greatly enhance productivity.

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Fully Automatic Heavy Wire Wedge Bonder with a large working area

Bondjets BJ985...

Bondjet BJ985 – Battery Bonder

Fully Automatic Heavy Wire Wedge Bonder with a large working area

Bondjets BJ985 belongs to the new generation of ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips, automotive applications (e.g. batteries) and other materials.  It can be used as a fully automatic machine or operated manually.

Hesse offers the only available solution on the market of handling wires from 50 µm up to 600 µm** with only one bondhead.

Hesse GmbH, as technology leader, has designed the only heavy wire bondhead with a non destructive pulltest and a unique transducer integrated sensor for 100 % quality monitoring in real time.
A bondhead change from aluminium to copper can be realized within minutes. In addition to a standard configuration Hesse off ers automation concepts individually adapted for every application.

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