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Bondjet BJ935/BJ939

Fully Automatic Heavy Wire Bonder

The Bondjet BJ935/939 is an ultrasonic wedge-wedge bonder developed for the fully automated processing of a wide range of substrates, chips and other materials. The system can be used as a fully automatic machine or operated manually.

The Hesse GmbH as technology leader has designed the only heavy wire bondhead with non destructive pull test and a unique transducer integrated sensor for 100% quality monitoring in real-time. Further outstanding features are high speed and the largest bonding area. Advanced features available on Bondjet BJ935/939 are designed to meet your present and future requirements and greatly enhance productivity.

Description

Advanced Features and Process Advantages

  • 50 µm – 600 µm bondhead for Al, Cu, AlCu
  • Precisely programmable bondforce actuator: wire 2500 cN adjustable, Ribbon/Cu 5000 cN adjustable
  • Cutting methods:
    • Active Cutting: repeatable, precise, programmable cutting depth
    • Air Cut: No impact on surface, e.g. for highly sensitive chips because of „touch-free“ cutting
    • Passive Cutting
  • E-Box: patented solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge

Flexibility

  • Working area BJ935: 254 mm x 244 mm (10″ x 9.6″)
  • Working area BJ939: 350 mm x 560 mm (13.8″ x 22.0″)
  • Flexible use of the large working area, e.g. vacuum-clamping of up to six 5″ x 7″ standard DCBs
  • Maximization of throughput by automation with two or more parallel lanes

Quality

  • Continuous real time monitoring of wire deformation, transducer current and frequency within programmable control limits
  • Process integrated Quality Control PiQC – integrated in Hesse Mechatronics‘ Workbench: detection of further parameters by additional sensor system(e.g. friction) for 100% quality monitoring in real time (patented)
  • Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % safe on equipment
  • Integrated, non-destructive pulltest for wire and ribbon
  • PBS200 – server for central data management
  • BDE, traceability – in PBS200 integrated XML interface or customized implementation
  • SECS/GEM – in PBS200 integrated standardized server connection for automation and communication
  • MES – interface to Manufacturing Execution Systems, integrated or in PBS200 realized, customized implementation

Speed

  • Highest UPH due to linear motors for bonder and indexer

 

Working area

  • BJ935: X: 254 mm (10″); Y: 244 mm (9.6″); Z: 70 mm (2.75″)
  • BJ939: X: 350 mm (13.8″); Y: 560 mm (22.0″); Z: 70 mm (2.75″)
  • P-rotation: 440°

Cutting methods

  • active, passive, air cut (for frontcut)

Ultrasonics

  • Digital ultra-sound generator with PLL (Phase-Locked-Loop), internal frequency resolution <1 Hz
  • Ultrasonic power output: 100 W programmable

Wire

  • Al, Cu, AlCu: 50 µm – 600 µm (2 mil – 24 mil), application-dependent

Ribbon

  • Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm (Cu: 200 µm) (10 mil x 0.1 mil up to 80 mil x 16 mil)

In-line capabilities

  • Single or multi lane handler
  • Integrated PLC controller
  • Standard SMEMA input & output ports

Machine dimensions

  • BJ935: 670 x 1310 x 1.897 mm (26.4″ x 51.6″ x 74.7″), appr. 1100 kg
  • BJ939: 750 x 1560 x 1.897 mm (29.9″ x 61.4″ x 74.7″), appr. 1400 kg

Media connection

  • RJ45 (2 x)
  • Compressed (high-purity)
  • Vacuum
  • 16A AC
  • Digital IO´s
  • USB-Port
  • SMEMA

Available options

  • Backcut or frontcut bondheads with active cutter
  • Network program upload / download
  • CAD data import
  • Profibus support
Heavy Wire Bondhead HBK07

  • Type: HBK07 Froncut, Backcut
  • Transducer (bond frequency): 60 kHz (optional 40 kHz)
  • Wire: Al, Cu, AlCu: 50 µm – 600 µm (2 mil – 24 mil), application-dependent
  • Speed: Up to 3 wires/sec.
  • Bonding force: 2500 cN adjustable
  • Wedge length: 2.5″for 60 kHz (2.80″ for 40 kHz)

Heavy Wire Bondhead HBK08

  • Type: HBK08 Backcut (Option: Loopformer)
  • Transducer (bond frequency): 60 kHz
  • Wire: Al, Cu, AlCu: 125 µm – 500 µm (5 mil – 20 mil), optional 50 µm (2 mil)
  • Wedge length: 2.5″

Heavy Wire Bondhead RBK01 Ribbon

  • Type Ribbon: RBK01  Froncut
  • Transducer (bond frequency): 57 kHz
  • Ribbon Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm (Cu: 200 µm) (10 mil x 1 mil up to 80 mil x 16 mil)
  • Bonding force: 5000 cN adjustable
  • Wedge length: 2.622″

Heavy Wire Bondhead RBK01 Copper

  • Type Copper: RBK01  Froncut, Backcut
  • Transducer (bond frequency): 57 kHz
  • Wire: Cu : 50 µm – 600 µm (2 mil – 24 mil)
  • Bonding force: 5000 cN adjustable
  • Wedge length: 2.733″
E-Box

Adjustment tool for wire bonders

The E-Box of the Hesse GmbH is a patent-registered visualisation system for control supported, reproducible adjustments of bondhead elements. It includes a camera for optical displaying of wedge, cutter and wire guide as well as a graphical support for adjustment- and positioning control. E-Box allows significant time reduction for setting up the machine. Software enhanced optical adjustment system for wedge, cutter and wire guide / wire clamp.

 

E-Box for Bonder – Advantages during Production

  • Better reproducibility of the adjustment depending attributes (e.g. loop forming) after change of wearing parts
  • Longer life time of wearing parts

 

Advantages for Bond Process

  • System for reproducible set-up of wedge, cutter and wire guide / wire clamp
  • Set-up without microscope
  • Free programmable, specified positions for bondhead elements
    • shown as limitation line
    • different views selectable (different sides, bottom, front etc.)
  • Minimizes time expenditure for set-up work, set-up control and readjustment
  • Process secured adjustment of wire feed elements (wedge, wire clamp, wire guide, cutter etc.)
  • Graphical supported, visual control of
    • wedge and wire guide position
    • distance between wedge and wire clamp
    • gap of wire clamp
    • wire pass
    • cutter respectively cutting position
Process integrated Quality Control system PiQC
 

The Hesse GmbH has implemented a new Process integrated Quality Control system (PiQC) that is unique to the global wire bonding market. A sensor integrated into the Transducer allows for the first time a multi-dimensional signal analysis of the bond process.
PiQC calculates a bond quality index value in realtime, using significant signals from the wire-bonding process.

Advantages for volume production

  • Inspection of every bond
  • No mechanical load of the bond connection
  • Product specific configuration of the quality control system

Feedback from the process

  • Mechanical oscillation of the wedge
  • Friction at bond surface
  • Transducer current
  • Ultrasonic frequency progression
  • Wire deformation

Quality statements by PiQC

  • PiQC calculates a quality index for each bond based on the actual feedback signal from the process
  • The signal related components of the quality index can be displayed graphically at any time

Teach mode for reference data

  • Detailed automatic analysis of the welding process
  • Extraction of process-specific reference data
PBS200 - Wire Bonder Server

The PBS200 Wire Bonder Server is a Windows based system to connect up to 20 Hesse Mechatronics wire bonders at your factory. You can supervise and administrate the machines while production is running. With PBS200 you will have perfect integration of your wire bonders in the production system.
The wire bonders communicate with PBS200 Server over the powerful XML based PBS network protocol.

Features of PBS200

  • „„Backup all the data of all connected wire bonders
  • User Administration and assignment of user accounts to wire bonders or production lines
  • Process Data in real time, ability to store the process data you need and import in Microsoft Excel (Option)
  • Masterprogramming
  • Customization PBS200 can be enhanced according to specific customer requirements for traceability or an MES Server connection (Option). Allow the MES system to decide, what process program is used, store the process results in your MES system. Implement your rework strategy on the Wire Bonders
  • SECS/GEM – compliant module is available for PBS200 (Option)
  • Multi Server: Run multiple PBS200 Servers and administrate all with the PBS Workbench in your office

PBS200 includes

  • PBS200 Client license for one wire bonder
  • PBS200 Hardware with Windows 7 Professional™ and 2 network adaptors
  • PBS200 Server license for one server
  • PBS & PiQC Workbench with USB stick license key

Available Process Data

  • Logbook Data
  • Machine Configuration
  • Important Program Parameters
  • Device ID and Bond Position
  • PiQC Quality Values
  • Deformation and Current Charts
  • Material and Tool Counters
  • Statistical Data
Automation

The precise and safe handling of the products in and out of the production machine plays a significant role in controlling the product quality, yield and efficiency of the production equipment. For this reason Hesse GmbH is offering automation concepts individually adapted for every application.

 

 

The portfolio of automation components for our machines consists of the following groups:

  • Indexer / Transport system
  • Bonding Station
  • Magazine Lifts
  • Visualization
  • MES Interface

All our machines are suitable for integration into production lines. This also applies to indexers and magazine lifts, which generally communicate to neighbouring systems by SMEMA interface. The customer specific special solutions which differ from the standard, have lead to some extraordinary optional features, such as:

  • Indexer with automatic rail width adjustment
  • Indexer with tilt function for bonding 3-dimensional MID’s
  • Integrated barcode scanner for automatic program selection
  • Indexer with 2 or 3 rails for parallel AUER boat processing
  • Manual heated workholder with adjustable height for maximum flexibility
  • Magazine lifts with capacity for multiple magazines

Bondjet BJ935/939 Datasheet

PBS200 Datasheet

E-Box Datasheet