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Bondjet BJ935/BJ939

Fully Automatic Heavy Wire Bonder

The Bondjet BJ935/939 is an ultrasonic wedge-wedge bonder developed for the fully automated processing of a wide range of substrates, chips and other materials. The system can be used as a fully automatic machine or operated manually.

The Hesse GmbH as technology leader has designed the only heavy wire bondhead with non destructive pull test and a unique transducer integrated sensor for 100% quality monitoring in real-time. Further outstanding features are high speed and the largest bonding area. Advanced features available on Bondjet BJ935/939 are designed to meet your present and future requirements and greatly enhance productivity.

Advanced Features and Process Advantages

  • 50 µm – 600 µm bondhead for Al, Cu, AlCu
  • Precisely programmable bondforce actuator: wire 2500 cN adjustable, Ribbon/Cu 5000 cN adjustable
  • Cutting methods:
    • Active Cutting: repeatable, precise, programmable cutting depth
    • Air Cut: No impact on surface, e.g. for highly sensitive chips because of „touch-free“ cutting
    • Passive Cutting
  • E-Box: patented solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge

Flexibility

  • Working area BJ935: 254 mm x 244 mm (10″ x 9.6″)
  • Working area BJ939: 350 mm x 560 mm (13.8″ x 22.0″)
  • Flexible use of the large working area, e.g. vacuum-clamping of up to six 5″ x 7″ standard DCBs
  • Maximization of throughput by automation with two or more parallel lanes

Quality

  • Continuous real time monitoring of wire deformation, transducer current and frequency within programmable control limits
  • Process integrated Quality Control PiQC – integrated in Hesse Mechatronics‘ Workbench: detection of further parameters by additional sensor system(e.g. friction) for 100% quality monitoring in real time (patented)
  • Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % safe on equipment
  • Integrated, non-destructive pulltest for wire and ribbon
  • PBS200 – server for central data management
  • BDE, traceability – in PBS200 integrated XML interface or customized implementation
  • SECS/GEM – in PBS200 integrated standardized server connection for automation and communication
  • MES – interface to Manufacturing Execution Systems, integrated or in PBS200 realized, customized implementation

Speed

  • Highest UPH due to linear motors for bonder and indexer

 

Working area

  • BJ935: X: 254 mm (10″); Y: 244 mm (9.6″); Z: 70 mm (2.75″)
  • BJ939: X: 350 mm (13.8″); Y: 560 mm (22.0″); Z: 70 mm (2.75″)
  • P-rotation: 440°

Cutting methods

  • active, passive, air cut (for frontcut)

Ultrasonics

  • Digital ultra-sound generator with PLL (Phase-Locked-Loop), internal frequency resolution <1 Hz
  • Ultrasonic power output: 100 W programmable

Wire

  • Al, Cu, AlCu: 50 µm – 600 µm (2 mil – 24 mil), application-dependent

Ribbon

  • Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm (Cu: 200 µm) (10 mil x 0.1 mil up to 80 mil x 16 mil)

In-line capabilities

  • Single or multi lane handler
  • Integrated PLC controller
  • Standard SMEMA input & output ports

Machine dimensions

  • BJ935: 670 x 1310 x 1.897 mm (26.4″ x 51.6″ x 74.7″), appr. 1100 kg
  • BJ939: 750 x 1560 x 1.897 mm (29.9″ x 61.4″ x 74.7″), appr. 1400 kg

Media connection

  • RJ45 (2 x)
  • Compressed (high-purity)
  • Vacuum
  • 16A AC
  • Digital IO´s
  • USB-Port
  • SMEMA

Available options

  • Backcut or frontcut bondheads with active cutter
  • Network program upload / download
  • CAD data import
  • Profibus support
Heavy Wire Bondhead HBK07

  • Type: HBK07 Froncut, Backcut
  • Transducer (bond frequency): 60 kHz (optional 40 kHz)
  • Wire: Al, Cu, AlCu: 50 µm – 600 µm (2 mil – 24 mil), application-dependent
  • Speed: Up to 3 wires/sec.
  • Bonding force: 2500 cN adjustable
  • Wedge length: 2.5″for 60 kHz (2.80″ for 40 kHz)

Heavy Wire Bondhead HBK08

  • Type: HBK08 Backcut (Option: Loopformer)
  • Transducer (bond frequency): 60 kHz
  • Wire: Al, Cu, AlCu: 125 µm – 500 µm (5 mil – 20 mil), optional 50 µm (2 mil)
  • Wedge length: 2.5″

Heavy Wire Bondhead RBK01 Ribbon

  • Type Ribbon: RBK01  Froncut
  • Transducer (bond frequency): 57 kHz
  • Ribbon Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm (Cu: 200 µm) (10 mil x 1 mil up to 80 mil x 16 mil)
  • Bonding force: 5000 cN adjustable
  • Wedge length: 2.622″

Heavy Wire Bondhead RBK01 Copper

  • Type Copper: RBK01  Froncut, Backcut
  • Transducer (bond frequency): 57 kHz
  • Wire: Cu : 50 µm – 600 µm (2 mil – 24 mil)
  • Bonding force: 5000 cN adjustable
  • Wedge length: 2.733″
E-Box
Process integrated Quality Control system PiQC
PBS200 - Wire Bonder Server
Automation

Bondjet BJ935/939 Datasheet

PBS200 Datasheet

E-Box Datasheet