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Home / Micro Electronics Packaging / Wire Bonding

Wire Bonding

Manual, Semi-Automatic and Full Automatic Wire Bond System for Wedge, Ball, Bump and Ribbon Bonding. High quality Capilary’s, Wedges and Bonding Wires.

TPT Wire Bonders (9)
Automatic Wire Bonding (11)

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Flying Probe Testing
Micro Electronics Packaging
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Flying Probe Testing
Micro Electronics Packaging
Equipment Rental
Repair & Calibration
Training & Consulting

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Advanced Dicing Technologies - Dicing Saws

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Luchthavenweg 18-b
5657 EB Eindhoven
The Netherlands
+31 40 7501650
09:00h - 17:00h
info@accelonix.nl

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Accelonix Services

Flying Probe Testing
Micro Electronics Packaging
Equipment Rental
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Training & Consulting

Flying Probe Testing
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Repair & Calibration
Training & Consulting

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Luchthavenweg 18-b
5657 EB Eindhoven
The Netherlands
+31 40 7501650
09:00h - 17:00h
info@accelonix.nl

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