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Home / Micro Electronics Packaging / Wire Bonding

Wire Bonding

Manual, Semi-Automatic and Full Automatic Wire Bond System for Wedge, Ball, Bump and Ribbon Bonding. High quality Capilary’s, Wedges and Bonding Wires.

TPT Wire Bonders (9)
Automatic Wire Bonding (11)

Accelonix Services

Flying Probe Testing
Micro Electronics Packaging
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Flying Probe Testing
Micro Electronics Packaging
Equipment Rental
Repair & Calibration
Training & Consulting

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Our Partners

Tresky Gmbh - Micro Assembly Solutions

EMTestPartner

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MilmegaPartner

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takaya-ok

Hesse Mechatronic - Automatic Wire Bonders

March - Plasma Systems

Tresky - Micro Assembly and Rework

IFIPartner

aster_technologies

Advanced Dicing Technologies - Dicing Saws

CyberTechnologies - 3D Surface Metrology

Deweyl - Wire Bonding Tools

IETLabsPartner

MPE - EMI/EMP filters

Comet Yxlon high-end X-ray and CT systems

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Luchthavenweg 18-b
5657 EB Eindhoven
The Netherlands
+31 40 7501650
info@accelonix.nl

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Accelonix Services

Flying Probe Testing
Micro Electronics Packaging
Equipment Rental
Repair & Calibration
Training & Consulting

Flying Probe Testing
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Repair & Calibration
Training & Consulting

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