TPT Wire bonders have been designing and manufacturing wire bonders since 1996. They are a privately owned company providing the highest quality wire bonding and semiconductor equipment to the microelectronics industry, from Universities and colleges to leading semiconductor, aerospace and medical device manufactures.
TPT was the first company to produce a wire bonder capable of both wedge and ball bonding, simply by changing the tool, a feature that is available across the range of fine wire bonders.
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