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Wire Bonders

TPT – Manual & Semi-Automatic Wire Bonders.

The HB05 manual series bench top wire bonder is easy to use and ideal for laboratories,...

TPT HB05

The HB05 manual series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.

An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.

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The TPT HB10 Semi-Automatic series bench top wire bonder is easy to use and ideal...

TPT HB10

The TPT HB10 Semi-Automatic series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.

An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.

The HB10 series also benefits from a motorised Z axis giving more control over the looping of the wire.

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The HB16 Semi-Automatic series bench top size wire bonder is easy to use and ideal...

TPT HB16

The HB16 Semi-Automatic series bench top size wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.

An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.

The HB16 series also benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease.

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The HB30 is a bench top size heavy wirebonder, easy to use and ideal for laboratories,...

TPT HB30

The HB30 is a bench top size heavy wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines.

The HB30 benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease.

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