TPT HB100

The HB100 represents a new generation of automatic desktop wire bonder with motorised Z-X-Y axis and bondhead rotation.

Perfectly suited for laboratories and small volume productions.
This versatile machine can perform wedge and ball bonding with a single bond head.
With fast, precise linear motor axis, the HB100 is very easy to use and packed with exciting features such as a touch-screen, dual camera system and joystick control.
In addition, the latest software technology supports the user with process guidance and bond assist features.

Description

Automatic Wire Bonder	Gold, aluminium, silver & copper wire	Wedge, ball & ribbon bonding
21″ Touch Panel	Automatic bond height adjustment	Simple Loop Programming
Repeatable Loop Profiles	Deep & wide access	Motorised Wire Clamp