The HB100 represents a new generation of automatic desktop wire bonder with motorised Z-X-Y axis, bondhead rotation and pattern recognition.
- Perfectly suited for laboratories and small volume productions.
- This versatile machine can perform wedge and ball bonding with a single bond head.
- With fast, precise linear motor axis, the HB100 is very easy to use and packed with exciting features such as a touch-screen, dual camera system and joystick control.
- In addition, the latest software technology supports the user with process guidance and bond assist features.