BJ855 is the successor of the proven Bondjet BJ820, the world‘s leading fully automated fine wire wedge-wedge wire bonder.
New features:
Optimized pattern recognition (PR)
Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, …)
Hesse Assist Tools: load cell, bondtool and wire spool detection, bond tool calibration without wedge gauge for operator independency
BJ855 is the successor of the proven Bondjet BJ820, the world‘s leading fully automated fine wire wedge-wedge wire bonder.
New features
Optimized pattern recognition (PR)
Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, …)
Hesse Assist Tools: load cell, bondtool and wire spool detection, bond tool calibration without wedge gauge for operator independency
Bonding speed: up to 7 wires per second
Largest working area: X: 305 mm (12.0″); Y:410 mm (16.1″)
Greatest axis accuracy
Al, Au: down to 12.5 µm up to 75µm*, Cu: 17.5 µm – 50 µm*, ribbon up to 25 µm x 250 µm*
Advanced Features and Process Advantages
High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
Precise bondforce control (static and dynamic)
E-Box: patented solution for optimized tool change and programmable alignment marks for wedge
and wire clamp
Speed
7 wires per second, application-dependent, e.g. with 25 μm wire, 1 mm loop length, metallized wafer
Loop Design
Loop generator for individualized loops
Fine pitch: 40 μm inline, 25 μm staggered/dual line (depending on wire diameter and loop)
Loop form functions
Constant wire length
Constant loop height
Individual loop shapes
Quality
Continuous real time monitoring of wire deformation, transducer current, frequency and impedance within programmable control limits
Process integrated Quality Control PiQC: detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented); available as an option.
Bondhead 45°, 60° (on request) and 90° (Deep Access for Ribbon and Wire)
Frequency: 100 kHz*; alternative frequencies available on request
Ribbon: Al, Au: 35 μm x 6 μm up to 250 μm x 25 μm** (1.4 mil x 0.25 mil up to 10 mil x 1 mil)**
Freely programmable wire feed, tail length, tear stroke and opening gap of wire clamp
Precise bondforce control (static and dynamic)
Bondheads can be replaced in minutes
Assist Tools - Load Cell
Load-Cell – used to calibrate and check the bond force
Automatic bond force calibration (no manual entry of force values)
No. of points to be measured can be chosen
More precise calibrated values
Assist Tools - Bond Tool Detection
E-Box detects Bond Tool label (DMX-Code)
SW checks BOM, validates material type and serial number
Production can start or cancelled due to incorrect bond tool
Tolerance verification of mechanical installation
E-Box
Adjustment tool for wire bonders
Optical display of wedge, wire guide and wire clamp and a graphical support for adjustment and positioning control
Minimizes time expenditure for set-up work, set-up control and readjustment (fast adjustment: 2-3 min, competitor: 15-20min)
Process secured adjustment of the wire feed elements
Camera image (5 orientations) can be stored in logbook after each tool change
Guaranteed repeatability set up
Process integrated Quality Control system PiQC
The Hesse GmbH has implemented a new Process integrated Quality Control system (PiQC) that is unique to the global wire bonding market. A sensor integrated into the Transducer allows for the first time a multi-dimensional signal analysis of the bond process. PiQC calculates a bond quality index value in realtime, using significant signals from the wire-bonding process.
Advantages for volume production
Inspection of every bond
No mechanical load of the bond connection
Product specific configuration of the quality control system
Feedback from the process
Mechanical oscillation of the wedge
Friction at bond surface
Transducer current
Ultrasonic frequency progression
Wire deformation
Quality statements by PiQC
PiQC calculates a quality index for each bond based on the actual feedback signal from the process
The signal related components of the quality index can be displayed graphically at any time
Teach mode for reference data
Detailed automatic analysis of the welding process
Extraction of process-specific reference data
Software Options
Software Options
Hesse Bonder Network (HBN): complete line management, synchronization of data, easy integration of new machines via Plug & Produce, no server necessary
PBS Server & Workbench 2.0: central data management, line management, automatic backup system, remote pattern recognition
TwinCAT® Automation: integration of control software for automation in Hesse Bonder Interface
SECS/GEM: integrated standardized server connection for automation and communication, handling via Workbench
MES: interface to Manufacturing Execution Systems, integrated or customized implementation
CSV-Logger: storage of all machine and process data, e.g. bond positions etc.
Login via USB stick
PBS200 - Wire Bonder Server
The PBS200 Wire Bonder Server is a Windows based system to connect up to 20 Hesse Mechatronics wire bonders at your factory. You can supervise and administrate the machines while production is running. With PBS200 you will have perfect integration of your wire bonders in the production system. The wire bonders communicate with PBS200 Server over the powerful XML based PBS network protocol.
Features of PBS200
Backup all the data of all connected wire bonders
User Administration and assignment of user accounts to wire bonders or production lines
Process Data in real time, ability to store the process data you need and import in Microsoft Excel (Option)
Masterprogramming
Customization PBS200 can be enhanced according to specific customer requirements for traceability or an MES Server connection (Option). Allow the MES system to decide, what process program is used, store the process results in your MES system. Implement your rework strategy on the Wire Bonders
SECS/GEM – compliant module is available for PBS200 (Option)
Multi Server: Run multiple PBS200 Servers and administrate all with the PBS Workbench in your office
PBS200 includes
PBS200 Client license for one wire bonder
PBS200 Hardware with Windows 7 Professional™ and 2 network adaptors
PBS200 Server license for one server
PBS & PiQC Workbench with USB stick license key
Available Process Data
Logbook Data
Machine Configuration
Important Program Parameters
Device ID and Bond Position
PiQC Quality Values
Deformation and Current Charts
Material and Tool Counters
Statistical Data
Automation
The precise and safe handling of the products in and out of the production machine plays a significant role in controlling the product quality, yield and efficiency of the production equipment. For this reason Hesse GmbH is offering automation concepts individually adapted for every application.
The portfolio of automation components for our machines consists of the following groups:
Indexer / Transport system
Bonding Station
Magazine Lifts
Visualization
MES Interface
All our machines are suitable for integration into production lines. This also applies to indexers and magazine lifts, which generally communicate to neighbouring systems by SMEMA interface. The customer specific special solutions which differ from the standard, have lead to some extraordinary optional features, such as:
Indexer with automatic rail width adjustment
Indexer with tilt function for bonding 3-dimensional MID’s
Integrated barcode scanner for automatic program selection
Indexer with 2 or 3 rails for parallel AUER boat processing
Manual heated workholder with adjustable height for maximum flexibility
Magazine lifts with capacity for multiple magazines
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