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Bondjet BJ855

BJ855 is the successor of the proven Bondjet BJ820, the world‘s leading fully automated fine wire wedge-wedge wire bonder.

New features:

  • Optimized pattern recognition (PR)
  • Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, …)
  • Hesse Assist Tools: load cell, bondtool and wire spool detection, bond tool calibration without wedge gauge for operator independency

 

BJ855 is the successor of the proven Bondjet BJ820, the world‘s leading fully automated fine wire wedge-wedge wire bonder.

New features

  • Optimized pattern recognition (PR)
  • Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, …)
  • Hesse Assist Tools: load cell, bondtool and wire spool detection, bond tool calibration without wedge gauge for operator independency
  • Bonding speed: up to 7 wires per second
  • Largest working area: X: 305 mm (12.0″); Y:410 mm (16.1″)
  • Greatest axis accuracy
  • Al, Au: down to 12.5 µm up to 75µm*, Cu: 17.5 µm – 50 µm*, ribbon up to 25 µm x 250 µm*

Advanced Features and Process Advantages

  • High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
  • Precise bondforce control (static and dynamic)
  • E-Box: patented solution for optimized tool change and programmable alignment marks for wedge
    and wire clamp

 Speed

  • 7 wires per second, application-dependent, e.g. with 25 μm wire, 1 mm loop length, metallized wafer

Loop Design

  • Loop generator for individualized loops
  • Fine pitch: 40 μm inline, 25 μm staggered/dual line (depending on wire diameter and loop)
  • Loop form functions
    • Constant wire length
    • Constant loop height
    • Individual loop shapes

Quality

  • Continuous real time monitoring of wire deformation, transducer current, frequency and impedance within programmable control limits
  • Process integrated Quality Control PiQC: detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented); available as an option.
  • Bondhead 45°, 60° (on request) and 90° (Deep Access for Ribbon and Wire)
  • Frequency: 100 kHz*; alternative frequencies available on request
  • Wire: Al, Au, Ag, Cu, Pt, Ni: 12.5 μm – 75 μm** (0.5 mil – 3 mil)**
  • Ribbon: Al, Au: 35 μm x 6 μm up to 250 μm x 25 μm** (1.4 mil x 0.25 mil up to 10 mil x 1 mil)**
  • Freely programmable wire feed, tail length, tear stroke and opening gap of wire clamp
  • Precise bondforce control (static and dynamic)
  • Bondheads can be replaced in minutes
Assist Tools - Load Cell
Assist Tools - Bond Tool Detection
E-Box
Process integrated Quality Control system PiQC
Software Options
PBS200 - Wire Bonder Server
Automation

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Bondjet BJ855 Datasheet

PBS200 Datasheet

E-Box Datasheet