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ADT 72XX Series

Full Automatic 8″ & 12″

Step into the Future of Dicing

With new architecture and advanced process control tools, the 7200 models deliver substantially higher productivity compared to existing dicing systems, while minimizing the cost of operation.

The system offers a wide range of advanced automation and process monitoring options to meet the requirements of your most challenging dicing applications.

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If you want to know more about ADT 72XX Series
Full Automatic 8″ & 12″

The 72xx Series Dicing Systems offer a wide range of advanced automation and process monitoring options to meet the requirements of your most challenging dicing applications:   

  • SiliconGlass on Silicon
  • MEMS
  • GaAs wafers
  • Package Singulation (BGA & QFN)
  • LTCC
  • PCB
  • Hard Materials

The 7200 Series is offered in three configurations optimized for IC applications, package singulation or hard material applications.

72xxSeries Advantages  

  • Unique Wx3 wafer handling system streamlines wafer flow for greater productivity
  • Continuous digital magnification vision System provides optimal magnification for any eye-point
  • Special agorithm predicts blade wear rates to reduce height measurement time and increase UPH
  • Touch panel display supports a user-friendly graphical interface (GUI)
  • Atomized wafer cleaning technology for superior process results
  • Dedicated dressing cassette enables automatic blade dressing
  • Built-in Inspection tray allows for in-process quality assessment
  • Unique multi-panel processing capabilities
  • Small footprint
  • Optional: Dressing Station for diamonds exposure and clogging prevention
Model 7222

2”, Air-bearing spindle, DC-brushless, rotate up to 60krpm.

Compatible with 2”- 3” hub and annular blades. Covering up to 8” round products.

Optimized for variety of products such as:

  • Silicon wafers
  • Thin-film devices
  • High-brightness LED packages
  • SAW filters
  • Glass wafers, IR filters
  • PZT transducers

System Specifications

  • Work piece size: Up to ∅ 200 mm or ∅ 300 mm
  • Blade size: 2″-3″
  • Spindle: Air bearing, DC-brushless 60 krpm, 1.2 kW

Indexing Axis (Y)

  • Drive: Ball bearing lead screw with stepper motor
  • Control: linear encoder
  • Resolution: 0.1 µm
  • Cumulative accuracy (∅200): 1.5 µm
  • Cumulative accuracy (∅300): 3 µm
  • Indexing accuracy: 1.0 µm

Feed Axis (x)

  • Drive: Ball bearing lead screw with DC-brushless motor
  • Feed rate: up to 600 mm/sec
  • Cut Depth Axis (z)
  • Drive: Ball bearing lead screw with DC-brushless motor
  • Resolution: 0.2 µm
  • Repeatability: 1.0 µm
  • Rotary Axis (θ)
  • Drive: closed-loop, direct-drive, DC-brushless
  • Resolution: 4 arc-sec
  • Stroke: 350 deg.

Vision System

  • Digital camera
  • High bright LED illumination (vertical & oblique)
  • Continuous digital magnification: from x 70 to x 280 or from 50 to x 200 (optional)

Cleaning Station

  • Full rinse and dry cycle
  • Spinning speed: 100-2,000 RPM
  • Cleaning methode: Atomizing capabilities

Wafer Handling System

  • Slot to slot integrity and Inspection drawer

Options

  • BBD (Broken Blade Detector)
  • Coating/Decoating system
  • Dress cassette
  • UV curing station
  • ESD (Electrostatic Discharge) kit
  • Barcode reader
  • Dress station
  • 360° turn table rotation
  • SECS-GEM host communication (optional)

User Interface

  • Flat 17″ touch screen
  • Graphical User Interface (GUI)
  • Multilanguage support
  • Keyboard & mouse

Utilities

  • Electrical: 200-240 VAC 50/60 Hz, Single phase
  • Air/N2: 700 L/min @ 5.5 bar
  • 500 L/min compressed air, 200 L/min process air/ N2
  • Spindle coolant: 1.1 L/min
  • Cutting Water (DI/tap): Blade/process coolant – up to 7 L/min

Dimensions (WXDXH):

  • ∅200: 965 x 1,460 x 1,700 mm
  • ∅300: 1,100 x 1,785 x 1,700 mm
  • Weight ∅200: 1,200 kg
  • Weight ∅300: 1,350 kg
Model 7223

2″-3″ High-torque, DC-brushless, Air-bearing, 2.4 kW, 60 krpm spindle system, optimized for package singulation and IC applications.

System Specifications:

Work piece size:

  • ∅200, Package singulation – up to 212 x 142 mm
  • ∅300, Package singulation – up to 245 x 234 mm
  • Blade size: 2″-3″
  • Spindle: Air bearing, DC-brushless, 60 krpm, 2.4 kW

Indexing Axis (Y)

  • Drive: Ball bearing lead screw with stepper motor
  • Control: linear encoder
  • Resolution: 0.2 µm
  • Cumulative accuracy (∅200): 1.5 µm
  • Cumulative accuracy (∅300): 3 µm
  • Indexing accuracy: 1.0 µm

Feed Axis (x)

  • Drive: Ball bearing lead screw with DC-brushless motor
  • Feed rate: up to 600 mm/sec

Cut Depth Axis (z)

  • Drive: Ball bearing lead screw with DC-brushless motor
  • Resolution: 0.2 µm
  • Accuracy: 2.0 µm
  • Repeatability: 1.0 µm

Rotary Axis (T)

  • Drive: closed-loop, direct-drive, DC-brushless
  • Accuracy: 4 arc-sec
  • Repeatability: 4 arc-sec
  • Stroke: 350 deg.

Vision System

  • Digital camera
  • High bright LED illumination (vertical & oblique)
  • Continuous digital magnification: from x170 to x280 or from x35 to x140 (optional)

Cleaning Station

  • Full rinse and dry cycle
  • Spinning speed: 100-2500 RPM
  • High pressure: up to 10 MPa
  • Atomizing cleaning capabilities

Wafer Handling System

  • Slot to slot integrity
  • Dress cassette
  • Inspection drawer

Options

  • BBD (Broken Blade Detector)
  • ESD (Electrostatic Discharge) kit (optional)
  • UV curing station (optional)
  • Barcode reader (optional)
  • Dress station (optional)
  • SECS-GEM host communication (optional)

User Interface

  • Flat 15″ touch screen
  • Graphical User Interface (GUI)
  • Multilanguage support
  • Keyboard & mouse

Utilities

  • Electrical: 200-240 VAC 50/60 Hz, Single phase
  • Air/N2: 700 L/min @ 5.5 bar
  • 500 L/min compressed air, 200 L/min process air/ N2
  • Spindle coolant: 1.1 L/min tap water
  • Process Water (DI): Blade/process coolant – up to 7 L/min
  • Atomized cleaning: up to 0.15 L/min
  • High pressure cleaning: up to 5 L/min (optional)

Dimensions (WxDxH):

  • ∅200: 965 x 1460 x 1700 mm
  • ∅300: 1100 x 1785 x 1700 mm
  • Weight ∅200: 1200 kg
  • Weight ∅300: 1350 kg
Model 7224

4″-5″ High-torque, DC-brushless, Air-bearing, 2.5 kW, 30 krpm spindle system, optimized for automated dicing of hard materials.

System Specifications:

  • Work piece size: ∅ 200 or ∅ 300
  • Blade size: 4″-5″
  • Spindle: Air bearing, DC-brushless, 30 krpm, 2.5 kW

Indexing Axis (Y)

  • Drive: Ball bearing lead screw with stepper motor
  • Control: linear encoder
  • Resolution: 0.2 µm
  • Cumulative accuracy (∅200): 1.5 µm
  • Cumulative accuracy (∅300): 3 µmIndexing accuracy: 1.0 µm

Feed Axis (x)

  • Drive: Ball bearing lead screw with DC-brushless motor
  • Feed rate: up to 600 mm/sec
  • Cut Depth Axis (z)
  • Drive: Ball bearing lead screw with DC-brushless motor
  • Resolution: 0.2 µm
  • Accuracy: 2.0 µm
  • Repeatability: 1.0 µm

Rotary Axis (T)

  • Drive: closed-loop, direct-drive, DC-brushless
  • Accuracy: 4 arc-sec
  • Repeatability: 4 arc-sec
  • Stroke: 350 deg.

Vision System

  • Digital camera
  • High bright LED illumination (vertical & oblique)
  • Continuous digital magnification: from x170 to x280 or from x35 to x140 (optional)

Cleaning Station

  • Full rinse and dry cycle
  • Spinning speed: 100-2500 RPM
  • High pressure: up to 10 MPa
  • Atomizing cleaning capabilities

Wafer Handling System

  • Slot to slot integrity
  • Dress cassette
  • Inspection drawer

Options

  • BBD (Broken Blade Detector)
  • ESD (Electrostatic Discharge) kit (optional)
  • UV curing station (optional)
  • Barcode reader (optional)
  • Dress station (optional)
  • SECS-GEM host communication (optional)

User Interface

  • Flat 15″ touch screen
  • Graphical User Interface (GUI)
  • Multilanguage support
  • Keyboard & mouse

Utilities

  • Electrical: 200-240 VAC 50/60 Hz, Single phase
  • Air/N2: 700 L/min @ 5.5 bar
  • 500 L/min compressed air, 200 L/min process air/ N2
  • Spindle coolant: 1.1 L/min tap water
  • Process Water (DI): Blade/process coolant – up to 7 L/min
  • Atomized cleaning: up to 0.15 L/min
  • High pressure cleaning: up to 5 L/min (optional)

Dimensions (WxDxH):

  • ∅200: 965 x 1460 x 1700 mm
  • ∅300: 1100 x 1785 x 1700 mm
  • Weight ∅200: 1200 kg
  • Weight ∅300: 1350 kg
Dicing Floor Management (DFM)

DFM system is a software and hardware option based on SECS/GEM* communication protocol that collects data and monitors all dicing saw machines at the production floor.

The DFM system will generate detailed reports such as UPH, up time, production data and other useful information for the production managers and is also of great value to your customers who demand data tracking.

Full barcode capability is embedded in the system for operator simplicity.

The DFM system will support up to 30 ADT different dicing saw machines.

The main advantages:

  • Transparency & real time visibility of the production floor
  • Progressive production monitoring
  • Monitoring the production efficiency
  • Tracking operator performances
  • Increasing productivity
  • Increased reliability and quality
  • Easy to file reports (daily, weekly and monthly)
  • Blade inventory management
  • Recipe backups
  • Capability to transfer recipe between the systems
Coating De-coating system


Many applications, as MEMS devices and Optic components, are sensitive to the environment developed during the dicing process.

To protect the wafer during the dicing process, avoiding component damage, ADT has developed an option which coats the wafer with a very thin film of a transparent coating material before the dicing process, later removed as part of the wafer cleaning process.

Dressing Procedure

ADT has developed a new software feature that provides the ability to ‘dress and drag’ (Y axis moves forward at a programmed speed dragging the blade into the dress material) the blade to maintain a flat edge on the dicing blade instead of a standard “dicing” methods on a dress block.

This feature is available on the new 7120 / 7130 / 7220 dicing machines.

Field retrofit is available.

Tapeless 7134 dicing saw

ADT has recently completed a new project for dicing in a tapeless process mode. The work piece is placed on a formal rubber pad with vacuum holes, holding the workpiece and diced parts in place during the dicing process without the use of dicing tape.

To create a high level of vacuum on the tapeless dicing chuck, the dicing machine is configured with a special high level vacuum pump and a special large water separator.

The above solution is also available on the 7122 / 7132 / 7124 dicing systems, including the possibility of supporting small dies.

Barcode Reader


The dicing saws support the option of adding a Barcode reader.
On the semi-automatic dicing machines (7120 / 7130) the barcode reader is external while on the automatic dicing saws (7220) the barcode reader is internal.

This option supports various types of barcodes that can be read from the frame, from the cassette or from a paper.

Scrap Removal

The Scrap Removal kit was designed for customers dicing applications that create a lot of dirt and/or want to filter and manage the cutting waste.
This kit includes a surface that guides the water and diced remaining to a tank before going to the drain.

*This option is available with orders of new dicing machines only.


ADT 7220 Series Datasheet

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