Studio Software

Akrometrix Studio is an advanced software package integrated to run on all Akrometrix Warpage Systems and offers users the capability to set up various custom warpage characteristic measurements.

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Profile Generator: (Create Temperature Profiles)

  • Create thermal profiles graphically; ‘click’ to add temperature points and actions
  • Assign ramp rates, soak times and cool down periods using numerical settings
  • Set machine control action points by clicking on profile segments
    • Measurement points
    • Blower on/off points
    • Exhaust on/off points

Surface Measurement: (Measurement Setup)

  • Work from a live system view to setup multiple test parameters
  • Run multiple phase image and 3D measurement results windows concurrently
  • View displacement graphs and data when data is acquired
  • Work with multiple regions of interest
  • DIC, DFP, CRE6, and SRM modules integrate seamlessly into the same workflow
  • Includes Part Tracking and Real Time Analysis (RTA) features

Thermal Profiler: (Measure warpage over temperature)

  • Apply test setup from Surface Measurement over temperature
  • Load profiles from Profile Generator
  • Optimize thermal conditions: error band, heater power, lower while heating, etc.
  • Immediate results feedback during profiling

Surface Analysis: (In-depth data processing)

  • One off:
    • Analyze and compare 2D and 3D data sets
    • View up to 5 million displacement data points on each graph
    • Control multiple graphs on-screen at once
    • Mask areas and burn masks permanently into phase images
    • Calculate one displacement data set relative to another
    • Export data for further analysis into computational applications such as ANSYS and MATLAB
    • Draw 2D chord lines across phase images at any angle
    • Zoom, rotate, crop and export 3D displacement graphs in multiple formats
  • Batch Processing:
    • All one off operations available in batch processing
    • Apply masks, filters, chords, rotation and other operations to hundreds of phase or displacement data sets
    • Multiple output and export options for graphical and analytical analyses
    • Quickly report on hundreds of data sets utilizing Automated Report Generator
    • Export data for use in Interface Analysis





Digital Fringe Projection

Flatness Measurement and Analysis Technique

The Digital Fringe Projection (DFP) technique compliments the shadow moiré technique by adding step height measurement capabilities at high data point density. This technique is particularly useful for measurement of connectors, sockets, assembled modules, and PCB local areas.

No grating is needed for the DFP technique, which helps with issues like outgassing and temperature uniformity sometimes seen with the shadow moiré technique. DFP also has the advantage of not being limited by data density, unlike the shadow moiré technique.

DFP has the disadvantage of warpage resolution being dependent on field of view. For this technique a field of view of 64x48mm, generating a measurement resolution of 5 microns, was chosen.

The strengths of the DFP measurement technique include:

  • Full field data acquired in less than 2 seconds
  • Able to measure sudden and large height changes up to nearly 20mm
  • High data point density

The DFP technique is offered as:

  • A DFP module on the AXP system
  • The base technology for the CXP system


Digital Image Correlation

In-plane strain and CTE measurement Technique

Digital Image Correlation (DIC) is a non-contact, full-field optical technique for measuring both in-plane and out-of-plane displacements of an object surface. A high contrast, random speckle pattern is applied to the surface of interest. Two cameras are mounted above the oven, viewing the sample from different angles.

Two simultaneous images from both cameras are digitized. Software identifies the same point on the surface from both perspectives, using pattern recognition of the speckles within a small pixel window. Using the principle of stereo triangulation, the spatial position of the pixel window relative to the cameras is determined in 3D space. Stepping the pixel window across the sample, the displacement of the surface can be mapped out in 3 axes.

The strengths of the DIC measurement technique include:

  • In-plane strain measurement at <150 microstrain
  • Calculate average surface CTE from strain and temperature data

The DIC technique is offered in the form of the DIC 2.0 module on the following Akrometrix tools:

  • AXP
  • PS200S


Shadow Moiré

Flatness Measurement and Analysis Technique

Shadow Moiré is a non-contact, full-field optical technique that uses geometric interference between a reference grating and its shadow on a sample to measure relative vertical displacement at each pixel position in the resulting image. It requires a Ronchi-ruled grating, a white line light source at approximately 45 degrees to the grating and a camera perpendicular to the grating. Its optical configuration is shown in the figure to the right. A technique, known as phase stepping, is applied to shadow moiré to increase measurement resolution and provide automatic ordering of the interference fringes. This technique is implemented by vertically translating the sample relative to the grating

The strengths of the shadow moiré measurement technique include:

  • Full field data acquired in less than 2 seconds
  • Resolution down to <1 micron
  • Resolution is unchanged by field of view
  • Highly robust with minimal moving parts

The shadow moiré technique is offered on the following Akrometrix tools:

  • AXP
  • PS200S
  • PS600S
  • AKM600P


Akrometrix Testing Applications Document

Akrometrix General Brochure