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Micro Electronics Packaging

From our demo lab in Eindhoven (NL) our experienced Application Engineers are able to offer Micoelectronics Packaging Services.

Technical advise, flexibility, quality, fast delevery and a good and long term relation with our clients are the keywords for a succesfull coorperation.

  • Product and process demonstrations
  • Single prototype production
  • Low volume production
  • Process development and trainings

With our network of equipment manufacturers and local partners we are able to offer a solution for many Micro Electronics Packaging challenges.

DIE BONDINGFINE WIRE BONDINGHEAVY WIRE BONDING
DIE (EPOXY) BONDING SERVICES

For specialistic prototypes  to low/mid  volume production.

Automatic accurate epoxy bonding  : GaAs, Silicon, Glass Dies

  • Pickup from wafer, waffle of Gel Pak
  • Component size from 0,2 mm  to > 50mm
  • Programmable Pattern Dispensing
  • Handles CCD and other sensors, LCD’s MEMS.
  • Unique Die Stacking with Bond line Thickness.

Applications :

  • Chip on Board (COB)
  • Chip on Flex (COF)
  • Chip on Glass (COG)
  • Chip in Package (Ceramic, Metal and Plastic)
  • Many more…..

FINE WIRE BONDING SERVICES

For specialistic prototypes  to low volume production

Wedge-Wedge Bonding

  • Alumium wires
  • Gold wires

Ball – Wedge Bonding

  • Gold  wires

  

Gold Bump Bonding

  • Flip Chip technology

  

Other:

  • Ribbon bonding
  • Microwave en RF technology
  • Gold ribbon

HEAVY WIRE BONDING SERVICES

For specialistic prototypes  to low volume production

    

  • Heavy wire: 100µm – 500µm
  • Ribbon bonding
  • Tab Bonding
  • Insulated wire


High power Applications:

  • Batterypacks,  (fused wires)
  • LED’s
  • Automotive
  • Many Power Electronics
  • Many more…….

Accelonix has experience in the wire bonding and handling of Lithium-Ion cells used widely in Batterypacks for EHV!

Accelonix Micro Electronics Packaging Services Brochure