ADT, a worldwide leader in dicing solutions, is pleased to add a full line of Hub Blades to its wide range of products.

ADT’s range of Hub Blades is a perfect solution for the optimization of the dicing process for various types of materials such as: Silicon, GaAs and other wafers.

Our Hub Blades provide:

• Improved cut quality
• Longer blade life
• Higher UPH

With slower wear rate than Resin but faster than Nickel, Metal-bond (Sintered) blades are best suited for retaining package shape and size in applications such as:

• BGA
• Soft Alumina
• TiC
• LTCC
• Ferrite

Blade thickness varies from 3 mil to 60 mil (depending on diamond grit size)
Diamond grit size ranges from 2 microns to 70 microns (depending on blade thickness)

• Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and Glass
• Resin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size)
• Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness)
• Our new “D” series Resin Blade for QFN:

• The Nickel binder provides longer blade life and lower wear rate and together with the abrasive makes Nickel-bond Blades a perfect choice for soft material applications such as: PCB, Silicon and BGA
• Blade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size)
• Diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness)