+31 40 7501650

Resin-bond Dicing Blades

  • Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and Glass
  • Resin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size)
  • Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness)
  • Our new “D” series Resin Blade for QFN:
Contact us


Resin-bond Dicing Blades Datasheet 


Share on:

    * A confirmation will be send to your e-mail to validate a successful form subscription,
    In case you did not receive confirmation e-mail please refill the form again or contact Accelonix directly.

    Share on: