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Bond Testing

For over 25 years, Royce Instruments, Inc. has been an innovative global leader for design and manufacturing of precision assembly tools and high accuracy, low force bond testing equipment. Royce Instruments products include equipment for laser diode manufacturing, wire bond and die bond testing, semiconductor die pick and place into trays, waffle pack, and GelPak.

Royce Instruments equipment is utilized throughout the world by the leading semiconductor and photonics manufacturers, assembly subcontractors, computer manufacturers, aerospace companies, and most of the world’s largest auto and medical electronics device manufacturers.

Royce 610 – Dedicated Wire Pull Bond Tester

The Royce 610 Dedicated Wire...

Wire Pull Tester

Royce 610 – Dedicated Wire Pull Bond Tester

The Royce 610 Dedicated Wire Pull Bond Tester is designed for maximum throughput at an affordable cost, in a reliable system.

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Royce 620 – Multitest Bond Tester

The Royce 620 Multitest Bond Tester offers...

Multitest Bond Tester

Royce 620 – Multitest Bond Tester

The Royce 620 Multitest Bond Tester offers an attractive bond test solution that is midway between the Royce 650 and the Royce 610.

It performs all the most frequently used applications, and it employs manual sample positioning, which in some applications allows for higher productivity over a motorized XY stage.

 

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Royce 650 – Universal Bond Tester

The Royce 650 bond tester is the latest...

Universal Bond Tester

Royce 650 – Universal Bond Tester

The Royce 650 bond tester is the latest bond tester by Royce, which can be used to pull test, bond shear and die shear. It has a very user friendly S/W, which can be readily networked and the system has industry leading accuracy.

The 650 system can also automatically collate and export a wide variety of SPC data, to ensure that quality of production can be easily tracked.

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