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Thermal Warpage and Strain Metrology


Akrometrix is the global leader in the thermal warpage and strain metrology markets.

Based on Shadow Moiré fringe technology and on a modular methodology, the systems will provide warpage metrology over a temperature range from -50 to +300°C at 3°C per second with a z-axis resolution to 0.85 µm.

Users will be able to measure substrate & component warpage at room temperature and at critical temperature thresholds, understand the mating interface and coplanarity between two substrates and will be able to observe and measure how temperature affects strain on materials.

A range of systems will cater for substrates up to 610 x 600 mm, with modules to cater for step height measurement and for strain and coefficient of thermal expansion.

Warpage can be assessed over a programmable temperature range for individual die, components, PCB’s, and targeted regions of fully populated boards on virtually any substrate. The systems are supplied with the Akrometrix Studio Software Suite.

AXP 2.0 Thermal Warpage and Strain Measurement Tool

This modular metrology tool...

PS200S Thermal Warpage and Strain Measurement Tool

Using the same Shadow Moiré...

PS600S Thermal Warpage Measurement Tool

The PS600S offers the user a thermal...

AKM600P Warpage Measurement Tool For Fan Out Wafer Level Packages (FOWLP)

Derived...

TTSM Table Top Shadow Moiré

The TTSM (Table Top Shadow Moiré) Metrology System...

Akrometrix Module Options

Depending on the tasks required and the model of system,...

Akrometrix offers fast, flexible and accurate test services for:

  • Flatness,...