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X-Ray and Computed Tomography Inspection

Our X-ray (DR) and computer tomography (CT) system is designed to meet the requirements for safe, reliable, non-destructive testing of electronic, microelectronic, electromechanical and other small products.

It is also possible to inspect semiconductor components and electronic devices (solder joints) without having to disassemble the device.

  • X-Ray Inspection
  • Computed Tomography
  • Measurements of outer and inner structures


Wafer and Surface-mount Device (SMD) Level Inspection
Multilayer Printed Circuit Board (PCB) Level Inspection
Assembled Printed Circuit Boards (PCBA) Level Inspection
Inspection of Specific Components
Electronic Components and PCB Assembly Analysis
Assembly Analysis
Measurements of Internal and Structures
Reverse Engineering & Inspection of 3D Printed parts
3D Movies of Electronics components for presentations