Typical inspection tasks include:
• Testing of bond wires and bonding areas
• Cavity analysis conductive and non-conductive chip bonding compounds
• Testing of 3D integrated circuits (IC) solder joints (micro bumps, copper pillars, Through-Silicon Vias (TSV))
• Analysis of discrete components such as capacitors and coils
It is important to find cracks, open solder joints or voids via X-ray inspection. Additionally the measurement of pore sizes and their distribution is critical. Many of these inspections are performed automatically by the YXLON inspection systems for an improvement in the production process.
The YXLON CT systems provide the highest resolution 3D non-destructive failure analysis of semiconductor devices.
YXLON X-ray inspection technology is used in the production of multilayer printed circuit boards to measure the position offset and minimal residual ring width. High quality X-ray images in oblique view allow for the detailed observations.
• Visualization of individual layers
• Detection of defects
• Detection of failures
As an example, X-ray imaging can detect etching or layout errors, shorts caused by faulty interconnects and poor metallization of contact holes.
High-resolution YXLON X-ray imaging is widely used in failure analysis and production quality testing of electronic components, such as solder joint inspection. X-ray images help identify material defects and quality characteristics that influence the shape of the solder joint.
• Missing solder fillings
• Missing solder connections
• Solder voids
• Solder bridges
• Mistakes due to lack of wetting
The semi-automatic testing software on YXLON X-ray systems allows for quick and easy ‘teach-in’ programming, as well as the highest fault coverage and repeatability.
In components for power electronics (i.e. Insulated-Gate Bipolar Transistor (IGBT)) heat is passed over the solder joints to thick copper heat sinks. To achieve optimum heat transfer, the solder joints must be as free of voids as possible.
Although these hybrid components are often found within X-ray absorbing housings of tungsten and copper, which absorb X-rays to a high degree, high-contrast microfocus YXLON X-ray systems and detectors can be successful in solder joint inspection.
This is essential for the automatic calculation of absolute and percentage void size.
When testing sensors and electronic components, high-resolution YXLON X-ray techniques are used to inspect and to evaluate:
This technique provides a deeper view into the tiniest components and assemblies within three-dimensional structures, offering detailed information about defects,such as the volume ofblowholes, the ball shoe size when a solder ball has lifted, or the pad surface structure of an unsoldered solder ball This in depth information simplifes root cause analysis.
The ball-grid array (BGA) shown in below figure is a form of component in which the solder joints are hidden between the component and circuit board As a result, X-ray technology offers the only way to perform a complete quality inspection of the solder joints.
Computed Tomography (CT) is widely used to check the mechanical form and fit of assemblies.
CT is also often used to visualize components within a product, such as checking for the presence or orientation of components like gaskets or heating elements
Above figure shows the internal placement of a heating element for an e-cigarette
Our CT visualization software (VG Studio) allows operators to segment components and assign colors to the various items, such as the yellow used in above figure to highlight the heating element.
Over the past few years, CT has become accepted as an alternative to a coordinate measurement tool.
It allows measurement of internal features without the need to destroy a part. With good CT data scan, it is possible to verify many features quickly and with high accuracy.
Multiple processes are available to assist with reverse engineering using CT
In one method , features can be measured based on their CT volume, then recreated using CAD software (e g , AutoCAD, SolidWorks, etc )
Another method is to extract regular geometry elements from a CT data set (cylinders, planes, etc ) and convert from an stl (standard tessellation language) file
to a STEP (Standard for the Exchange of Product Model Data).
For additive manufacturing (3D printing) applications, clean, high quality standard tessellation language (STL) fles can be input directly into a 3D printer Modeling software can be used to make minor changes.
In some cases, this application does not require reverse engineering software.
We can also inspect 3D printed parts on voids and other printing defects.
With our VG Studio Software we can make stunning high resolution 3D Video’s of your components.
These video’s are widely used in websites, presentations and other marketing material.