Search

Bond Testing Services

From our demo lab in Eindhoven (NL) our experienced Application Engineers are able to offer Microelectronics Packaging and Bondtest Services.

Technical advise, flexibility, quality, fast delivery and a good and long term relation with our clients are the keywords for a succesfull coorperation.

  • Product and process demonstrations
  • Single prototype production
  • Low volume production
  • Process development and trainings

With our network of equipment manufacturers and local partners we are able to offer a solution for many Micro Electronics Packaging challenges.

Quick Enquiry

If you want to know more about Bond Testing Services

BOND TESTING SERVICES

Pulltest

  • For Fine Wire Application up to 100 gF
  • For Ball and Wedge wire Bonds
  • Destructive and non-destructive
  • Force profile data saved per test
  • Results are presented in measurement report.


Ballshear (Sheartest)

  • Up to 250 gF
  • For sheartest of fine wire ball bondings.
  • Sheartest of Gold Bumps
  • Destructive and non-destructive
  • Force profile data saved per test
  • Results are presented in measurement report.

Die shear / Heavy Wire Wedge Shear

  • Up to 5 kgF
  • For sheartest of small dies and components
  • Sheartest of heavy wire bond foots
  • Destructive and non-destructive
  • Force profile data saved per test
  • Results are presented in measurement report.

International standard compliance

  • MIL-STD-883
  • MIL-STD-750
  • ASTM F1269
  • JESD22-B117
  • JESD22-B116
  • CE

Accelonix Micro Electronics Packaging Services Brochure