TRAK Automated Series

The Nordson MARCH TRAK® series of gas plasma cleaning equipment provides unparalleled treatment uniformity and process consistency.

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The TRAK series plasma system delivers superior plasma treatment quality and automation in one very configurable platform, resulting in high-throughput plasma processing and plasma cleaning for semiconductor and electronics packaging. The plasma chamber is capable of processes such as dielectric etch, photoresist descum/ash, oxide removal, organic contamination clean and surface activation, depending upon chamber kit and electrode configuration.

TRAK systems support manual and automated operations (with inline or built-in handler), SMEMA and SECS/GEM communications protocol, and remote user interface. The versatile, exceptionally uniform, and compact chamber design allows for interchangeable processing configurations and plasma modes – direct, RIE, downstream, and IFP (ion-free plasma) plasma treatment options.

A three-axis symmetrical plasma chamber ensures that all positions of the product are treated uniformly while tight controls over all process parameters ensure repeatable results from product to product.

  • The TRAK’s small plasma chamber volume and proprietary plasma process control enable unmatched short cycle times, while its slim structure minimizes floor space requirements.
  • The TRAK’s universal architecture handles a wide variety of product form factors, including boats, carriers, Jedec/Auer® boats, strips, laminates, and wafers.
  • Depending on throughput and product form requirements, the system can be configured for magazine-to-magazine processing of single and multiple strips or lead frames, wafer processing, and standalone for island-based production environments.
  • The TRAK’s SMART® Tune management system provides closed-loop plasma control that optimizes the RF system and minimizes tuning time. The system automatically recycles to a plasma-ready state, compensating for changes in vacuum pressure, temperature and varied lot sizes. Maximum power to the chamber is achieved in seconds with a proprietary algorithm that constantly measures forward and reflective power inside the chamber.
FlexTRAK™ Plasma Treatment System

FlexTRAK™ Plasma Treatment System: The standard configuration to meet the plasma cleaning and plasma treatment requirements of advanced semiconductor and electronic packaging.

FlexTRAK™-S Plasma Treatment System:

FlexTRAK™-S Plasma Treatment System: Specially designed for processing larger substrates, this model has a large-capacity plasma chamber, 9.24 liter, or twice the capacity of a standard FlexTRAK.

FasTRAK™ Plasma Treatment System:

FasTRAK™ Plasma Treatment System: Fully-automated, high-throughput, plasma treatment system for lead-frame strips, laminate substrates, and other strip-type microelectronic components. Easy to change over to a new magazine or strip size because recipes are software-driven and the system requires minimal hardware interaction or tooling. Virtually eliminates operator handling of the strips or magazines.

FlexTRAK™ 2MB Plasma Treatment System:

FlexTRAK™ 2MB Plasma Treatment System: Designed for high-throughput, inline processing of microelectronic devices held in boats, trays or other carriers; ideal for pre-Flip-Chip Underfill (FCUF) processes. Unique boat bypass feature optimizes productivity, multiple inline plasma modules and production-ready dual-lane boat handling increase throughput.

FlexTRAK™ CD and FlexTRAK™ CDS Plasma Treatment Systems:

FlexTRAK™ CD and FlexTRAK™ CDS Plasma Treatment Systems: Designed for high-throughput processing of lead frame strips, laminated substrates, and other strip-type electronic components. The -CD handles up to 5 strips per plasma cycle and the -CDS, with a longer plasma chamber, handles up to 10 strips per plasma cycle. The operation delivers the parts back into the same magazine; for different handling, refer to the FasTRAK system.

  • Ultimate application flexibility for direct, downstream and ion-free (patented) plasma, which allows treatment without exposure to ion and UV
  • Easily integrates with a variety of process equipment, including wire bond, die attach, dispense, mold, and marking
  • Slim structure that requires minimal floor space, all service components are easily accessible from the front
  • Compact, three-axis symmetrical chamber and proprietary process control for unmatched process uniformity
  • Industry leading throughput capacity with short cycle times


March FasTRAK Plasma System Datasheet

March FlexTRAK Plasma System Datasheet

March FlexTRAK-S Plasma System Datasheet

March FlexTRAK-2MB Plasma System Datasheet

March FlexTRAK-CD Plasma System Datasheet

March FlexTRAK-CDS Plasma System Datasheet