Fine Wire Bonders

The Hesse and TPT Automatic Fine Wire Bonders are ultrasonic wire bonders developed for the fully automated processing of a wide range of substrates, chips, batterypacks, solar panels and many other materials.

These system can typically handle wires from 12.5 µm – 75 µm  (Ribbons up to 250 µm x 25 µm.)

Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics.

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