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Fine Wire Bonders

The Hesse and TPT Automatic Fine Wire Bonders are ultrasonic wire bonders developed for the fully automated processing of a wide range of substrates, chips, batterypacks, solar panels and many other materials.

These system can typically handle wires from 12.5 µm – 75 µm  (Ribbons up to 250 µm x 25 µm.)

Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics.

 The HB100 represents a new generation of automatic desktop wire bonder with...

A Bonder for manual or automatic bonding

The Bondjet BJ653, with its changeable...

BJ855 is the successor of the proven Bondjet BJ820, the world‘s leading fully...

High Speed Fully Automatic Fine Wire Wedge Bonder

The Bondjet BJ820 is the world´s...

Fully Automatic Large Area Ball-Wedge Bonder

The Bondjet BJ830 is a fully automated,...