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Fine Wire Bonders

The Hesse and TPT Automatic Fine Wire Bonders are ultrasonic wire bonders developed for the fully automated processing of a wide range of substrates, chips, batterypacks, solar panels and many other materials.

These system can typically handle wires from 12.5 µm – 75 µm  (Ribbons up to 250 µm x 25 µm.)

Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics.

 The HB100 represents a new generation of automatic desktop wire bonder with...

TPT HB100

 The HB100 represents a new generation of automatic desktop wire bonder with motorised Z-X-Y axis and bondhead rotation.

  • Perfectly suited for laboratories and small volume productions.
  • This versatile machine can perform wedge and ball bonding with a single bond head.
  • With fast, precise linear motor axis, the HB100 is very easy to use and packed with exciting features such as a touch-screen, dual camera system and joystick control.
  • In addition, the latest software technology supports the user with process guidance and bond assist features.
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A Bonder for manual or automatic bonding

The Bondjet BJ653, with its changeable...

Bondjet BJ653

A Bonder for manual or automatic bonding

The Bondjet BJ653, with its changeable bond heads, serves the wire bonding processes of wedge-wedge as well as ball-wedge and can handle fine wire, heavy wire and ribbon.

The operating methods from manual to automatic bonding is particularly appropriate for the use in laboratories, in the development and for suppliers for validating their product quality.

 

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BJ855 is the successor of the proven Bondjet BJ820, the world‘s leading fully...

Bondjet BJ855

BJ855 is the successor of the proven Bondjet BJ820, the world‘s leading fully automated fine wire wedge-wedge wire bonder.

New features:

  • Optimized pattern recognition (PR)
  • Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, …)
  • Hesse Assist Tools: load cell, bondtool and wire spool detection, bond tool calibration without wedge gauge for operator independency

 

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High Speed Fully Automatic Fine Wire Wedge Bonder

The Bondjet BJ820 is the world´s...

Bondjet BJ820

High Speed Fully Automatic Fine Wire Wedge Bonder

The Bondjet BJ820 is the world´s leading fully automated fine wire wedge wedge bonder. The BJ820 is ready for all wire bonding challenges on a single platform, using wires and ribbons made of aluminium, copper and gold. Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics. The BJ820 defines the latest state of technological development compared to the competition and is benchmark for:

  • The highest bonding speed in the industry
  • The largest working area of fast running fine wire bonders
  • The greatest axis accuracy
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Fully Automatic Large Area Ball-Wedge Bonder

The Bondjet BJ830 is a fully automated,...

Bondjet BJ830

Fully Automatic Large Area Ball-Wedge Bonder

The Bondjet BJ830 is a fully automated, thermosonic fine wire ball-wedge bonder with a large working area. The BJ830 is designed for  wire bonding challenges on a single platform. Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics. The BJ830 defines the latest state of technological development compared to the competition and is benchmark for:

  • The largest working area of ball-wedge bonders
  • Precise positioning according to great axis accuracy
  • High reliability and repeatability
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