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Fine Wire Bonders

The Hesse and TPT Automatic Fine Wire Bonders are ultrasonic wire bonders developed for the fully automated processing of a wide range of substrates, chips, batterypacks, solar panels and many other materials.

These system can typically handle wires from 12.5 µm – 75 µm  (Ribbons up to 250 µm x 25 µm.)

Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics.

 The HB100 represents a new generation of automatic desktop wire bonder with...

BJ855 is the successor of the proven Bondjet BJ820, the world‘s leading fully...

A Bonder for manual or automatic bonding

The Bondjet BJ653, with its changeable...

High Speed Fully Automatic Fine Wire Wedge Bonder

The Bondjet BJ820 is the world´s...

Fully Automatic Large Area Ball-Wedge Bonder

The Bondjet BJ830 is a fully automated,...