Semi-Automatic Wire Bonder

The HB16 Semi-Automatic series bench top size wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.

An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.

The HB16 series also benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease.

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Semi-Automatic Wire Bonder

Gold, aluminium, silver & copper wire Wedge, ball & ribbon bonding Repeatable Loop Profiles
6.5″ Touch Panel Automatic bond height adjustment Simple Loop Programming
Storage of 100 parameters Deep & wide access Motorised Wire Clamp
Motorised Wire Spool Extension Kit compatibility
  • Gold Wire Diameter 17-75µ (0.7 – 3 mil)
  • Aluminium Wire Diameter 17-75µ (0.7 – 3mil)
  • Ribbon Size up to 25×250µ (1×8 mil)
  • 62kHz Transducer PLL Control
  • Ultrasonic Power 0-5 Watt Output
  • Bond Time 0-10 seconds
  • Bond Force 5-150cNm (350cNm option)
  • 90° Wire Feed Angle
  • 17mm Z Travel

TPT HB16 Datasheet