The HB16 Semi-Automatic series bench top size wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.

An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.

The HB16 series also benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease.