The HB05 manual series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.
An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.
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Gold, aluminium, silver & copper wire |  |
Wedge, ball & ribbon bonding |  |
Compact design & intuitive control |
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4″ TFT display & push dial |  |
Storage of 20 parameters |  |
Deep & wide access |
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Motorised Wire Clamp |  |
Extension Kit compatibility |
