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TPT HB05

The HB05 manual series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.

An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.

Description

HB05_Slider_1
HB05_Slider_2
HB16_Slider_2
HB16_Slider_3
Gold, aluminium, silver & copper wire Wedge, ball & ribbon bonding Compact design & intuitive control
4″ TFT display & push dial Storage of 20 parameters Deep & wide access
Motorised Wire Clamp Extension Kit compatibility    
  • Gold Wire Diameter 17-75µ (0.7 – 3 mil)
  • Aluminium Wire Diameter 17-75µ (0.7 – 3mil)
  • Ribbon Size up to 25×250µ (1×8 mil)
  • 62kHz Transducer PLL Control
  • Ultrasonic Power 0-5 Watt Output
  • Bond Time 0-1 seconds
  • Bond Force 5-150cNm
  • 90° Wire Feed Angle

TPT HB05 Datasheet