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The HB05 manual series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.

An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.

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Gold, aluminium, silver & copper wire Wedge, ball & ribbon bonding Compact design & intuitive control
4″ TFT display & push dial Storage of 20 parameters Deep & wide access
Motorised Wire Clamp Extension Kit compatibility    
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  • Gold Wire Diameter 17-75µ (0.7 – 3 mil)
  • Aluminium Wire Diameter 17-75µ (0.7 – 3mil)
  • Ribbon Size up to 25×250µ (1×8 mil)
  • 62kHz Transducer PLL Control
  • Ultrasonic Power 0-5 Watt Output
  • Bond Time 0-1 seconds
  • Bond Force 5-150cNm
  • 90° Wire Feed Angle
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TPT HB05 Datasheet 

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