Manual Wire Bonder

The HB05 manual series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.

An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.

Our HB05 gives you an easy access to the topic of bonding.
Look, aim, bond – done.

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If you want to know more about TPT HB05
Manual Wire Bonder


17μm to 75μm Wire

gold, aluminum, silver
& copper wire

One Bond Head

wedge, ball, bump
& ribbon bonding

Light Weight

weighs in total
only 29kg

Compact Design

smooth and
easy use

4“ TFT

fast and easy control of
all bonding parameters

Storage of 20 parameters

aasy setting recall for working
on different applications

Deep & Wide Bond Access

ample workspace due to
special bond head design

Motorized Wire Clamp

precise tail length control

Extension Kits

Pick & Place Kit, Pulltester,
Video Targeting, Copper Ball Bonding

  • Gold Wire Diameter 17-75µ (0.7 – 3 mil)
  • Aluminium Wire Diameter 17-75µ (0.7 – 3mil)
  • Ribbon Size up to 25×250µ (1×8 mil)
  • 63,3 kHz Transducer PLL Control
  • Ultrasonic Power 0-10 Watt Output
  • Bond Time 0-1 seconds
  • Bond Force 5-130cNm (350cNm option)
  • 90° Wire Feed Angle
  • Build-in Temperature controller

TPT HB05 Datasheet