TPT HB30 Heavy Wire Bonder
The HB30 is a bench top size heavy wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines.
The HB30 benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease.
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Heavy Wire Bonder
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Aluminium & copper wedge bonding |  |
Repeatable Loop Profiles |  |
6.5″ Touch Panel |
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Automatic bond height adjustment |  |
Simple Loop Programming |  |
Storage of 100 parameters |
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Deep & Wide Bond access |  |
High precision cutting sequence |  |
Vacuum Stage Fixation |
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Extension Kit compatibility |
- Aluminium Wire Diameter 100µm – 500µm
- PLL US System
- Ribbon Size up to 300µm x 2000µm
- Ultrasonic Power 20 Watt Output
- Bond Time 0-10 seconds
- Bond Force 5-1500cNm
- 90° Wire Feed Angle
- Loop profiles consisting of up to 10 steps
TPT HB30 Datasheet 
