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The HB30 is a bench top size heavy wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines.

The HB30 benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease.

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Aluminium & copper wedge bonding Repeatable Loop Profiles 6.5″ Touch Panel
Automatic bond height adjustment Simple Loop Programming Storage of 100 parameters
Deep & Wide Bond access   High precision cutting sequence Vacuum Stage Fixation
Extension Kit compatibility  
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  • Aluminium Wire Diameter 100µm – 500µm
  • PLL US System
  • Ribbon Size up to 300µm x 2000µm
  • Ultrasonic Power 20 Watt Output
  • Bond Time 0-10 seconds
  • Bond Force 5-1500cNm
  • 90° Wire Feed Angle
  • Loop profiles consisting of up to 10 steps!
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TPT HB30 Datasheet

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