Hesse BJ985

Battery Bonder

Fully Automatic Heavy Wire Wedge Bonder with a large working area

Bondjets BJ985 belongs to the new generation of ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips, automotive applications (e.g. batteries) and other materials.  It can be used as a fully automatic machine or operated manually.

Hesse offers the only available solution on the market of handling wires from 50 µm up to 600 µm** with only one bondhead.

Hesse GmbH, as technology leader, has designed the only heavy wire bondhead with a non destructive pulltest and a unique transducer integrated sensor for 100 % quality monitoring in real time.
A bondhead change from aluminium to copper can be realized within minutes. In addition to a standard configuration Hesse off ers automation concepts individually adapted for every application.

Quick Enquiry

If you want to know more about Hesse BJ985
Battery Bonder

Bondjet BJ985 is characterized by several new features:

  • Optimized pattern recognition (PR)
  • Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, …)
  • Hesse Assist Tools: load cell, bondtool and wire spool detection, tool calibration without wedge gauge for operator independency
  • Outstanding features of the new Bondjet BJ985 are the large bonding area of 370 mm x 870 mm, a high drive through and high speed

Advanced Features and Process Advantages

  • 50 µm – 600 µm** bondhead for Al, Cu, AlCu (2 mil – 24 mil)
  • Improved wire handling: short distance between bondhead and spool
  • Optimized pattern recognition: image capture with new digital image processing and flash
  • Hesse Assist Tools (option):
    • E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
    • Automated bondforce calibration; a load cell prevents operating error and ensures robust processes
    • Innovative bondtool detection
    • Wire spool detection
  • Automated bondtool calibration without wedge gauge
  • Precisely programmable bondforce actuator
  • Loop generator for individual loops
  • Wear-free components with Piezo-Technology
  • Maintenance-free solid state joints
  • Pre-setting of bondheads via EEPROM


  • Working area BJ985: 370 mm x 870 mm (14.6″ x 34.3″)
  • Flexible use of the large working area, e.g. vacuum-clamping of several 5″ x 7″ standard DCBs
  • Maximization of throughput by automation (two/more parallel lanes)


  • Continuous real time monitoring of wire deformation, transducer current and frequency within programmable control limits
  • Process integrated Quality Control PiQC: detection of further parameters by additional sensor system(e.g. friction) for 100% quality monitoring in real time (patented); as option
  • Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % save on equipment
  • Integrated, non-destructive pulltest for wire and ribbon

Heavy wire bondheads

  • Heavy wire and ribbon bondheads for Al, Cu and AlCu
  • An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
  • Wire clamp for loop shape control is standard on all bondheads; optionally equipped with non-destructive pulltest

Various loop form functions

  • Reproducible loop geometry by wire guide appropriate for the material involved and moving wire buffer
  • Constant wire length and loop height
  • Mechanically demanding loop geometrics by parameterization and individual wire clamp application
  • Individual loop shapes by configurable loop trajectory generator


Working area

  • BJ985: X: 370 mm (14.6″); Y: 870 mm (34.3″); Z: 42 mm (1.65″)
  • P-rotation: 440°

Cutting methods

  • active, passive, air cut (for frontcut)


  • Digital ultrasonic generator with PLL (Phase Locked Loop), internal frequency resolution <1 Hz
  • Programmable ultrasonic power output


  • Al, Cu, AlCu: 50 µm – 600 µm** (2 mil – 24 mil)


  • Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm** (Cu: 200 µm)
    (10 mil x 1 mil up to 80 mil x 16 mil)

Machine dimensions

  • BJ985: 1361 mm x 2144 mm x 1920 mm (53.6″ x 84.4″ x 75.6″), appr. 1750 kg

Media connection

  • Compressed (high-purity)
  • Vacuum
  • 16A AC
  • Digital IO´s
  • USB-Ports
  • SMEMA connection
  • Gigabit-Ethernet (TCP/IP)
  • Profibus support


Heavy Wire Bondhead HBK

  • Type: HBK Froncut, Backcut
  • Transducer (bond frequency): 60 kHz*
  • Wire: Al, Cu, AlCu: 50 µm – 600 µm** (2 mil – 24 mil), application-dependent
  • Bonding force adjustable
  • Wedge length: 2.5″for 60 kHz
Heavy Wire Bondhead RBK Ribbon
  • Type Ribbon: RBK  Froncut
  • Transducer (bond frequency): 60 kHz*
  • Wire: 250 µm x 25 µm up to 2000 µm x 400 µm** (Cu: 200 µm)
  • (10 mil x 1 mil up to 80 mil x 16 mil)
  • Bonding force adjustable
  • Wedge length: 2.622″
Heavy Wire Bondhead RBK Copper
  • Type Copper: RBK  Froncut, Backcut
  • Transducer (bond frequency): 60 kHz*
  • Wire: Cu : 50 µm – 600 µm** (2 mil – 24 mil)
  • Bonding force adjustable
  • Wedge length: 2.733″

Adjustment tool for wire bonders

The E-Box of the Hesse GmbH is a patent-registered visualisation system for control supported, reproducible adjustments of bondhead elements. It includes a camera for optical displaying of wedge, cutter and wire guide as well as a graphical support for adjustment- and positioning control. E-Box allows significant time reduction for setting up the machine. Software enhanced optical adjustment system for wedge, cutter and wire guide / wire clamp.


E-Box for Bonder – Advantages during Production

  • Better reproducibility of the adjustment depending attributes (e.g. loop forming) after change of wearing parts
  • Longer life time of wearing parts


Advantages for Bond Process

  • System for reproducible set-up of wedge, cutter and wire guide / wire clamp
  • Set-up without microscope
  • Free programmable, specified positions for bondhead elements
    • shown as limitation line
    • different views selectable (different sides, bottom, front etc.)
  • Minimizes time expenditure for set-up work, set-up control and readjustment
  • Process secured adjustment of wire feed elements (wedge, wire clamp, wire guide, cutter etc.)
  • Graphical supported, visual control of
    • wedge and wire guide position
    • distance between wedge and wire clamp
    • gap of wire clamp
    • wire pass
    • cutter respectively cutting position
Process integrated Quality Control system PiQC

The Hesse GmbH has implemented a new Process integrated Quality Control system (PiQC) that is unique to the global wire bonding market. A sensor integrated into the Transducer allows for the first time a multi-dimensional signal analysis of the bond process.
PiQC calculates a bond quality index value in realtime, using significant signals from the wire-bonding process.

Advantages for volume production

  • Inspection of every bond
  • No mechanical load of the bond connection
  • Product specific configuration of the quality control system

Feedback from the process

  • Mechanical oscillation of the wedge
  • Friction at bond surface
  • Transducer current
  • Ultrasonic frequency progression
  • Wire deformation

Quality statements by PiQC

  • PiQC calculates a quality index for each bond based on the actual feedback signal from the process
  • The signal related components of the quality index can be displayed graphically at any time

Teach mode for reference data

  • Detailed automatic analysis of the welding process
  • Extraction of process-specific reference data
Software Options

Software Options

  • Hesse Bonder Network (HBN): complete line management, synchronization of data, easy integration of new machines via Plug & Produce, no server necessary
  • PBS Server & Workbench 2.0: central data management, line management, automatic backup system, remote pattern recognition
  • TwinCAT® Automation: integration of control software for automation in Hesse Bonder Interface
  • SECS/GEM: integrated standardized server connection for automation and communication, handling via Workbench
  • MES: interface to Manufacturing Execution Systems, integrated or customized implementation
  • CSV-Logger: storage of all machine and process data, e.g. bond positions etc.
  • Login via USB stick


PBS200 - Wire Bonder Server

The PBS200 Wire Bonder Server is a Windows based system to connect up to 20 Hesse Mechatronics wire bonders at your factory. You can supervise and administrate the machines while production is running. With PBS200 you will have perfect integration of your wire bonders in the production system.
The wire bonders communicate with PBS200 Server over the powerful XML based PBS network protocol.

Features of PBS200

  • „„Backup all the data of all connected wire bonders
  • User Administration and assignment of user accounts to wire bonders or production lines
  • Process Data in real time, ability to store the process data you need and import in Microsoft Excel (Option)
  • Masterprogramming
  • Customization PBS200 can be enhanced according to specific customer requirements for traceability or an MES Server connection (Option). Allow the MES system to decide, what process program is used, store the process results in your MES system. Implement your rework strategy on the Wire Bonders
  • SECS/GEM – compliant module is available for PBS200 (Option)
  • Multi Server: Run multiple PBS200 Servers and administrate all with the PBS Workbench in your office

PBS200 includes

  • PBS200 Client license for one wire bonder
  • PBS200 Hardware with Windows 7 Professional™ and 2 network adaptors
  • PBS200 Server license for one server
  • PBS & PiQC Workbench with USB stick license key

Available Process Data

  • Logbook Data
  • Machine Configuration
  • Important Program Parameters
  • Device ID and Bond Position
  • PiQC Quality Values
  • Deformation and Current Charts
  • Material and Tool Counters
  • Statistical Data

The precise and safe handling of the products in and out of the production machine plays a significant role in controlling the product quality, yield and efficiency of the production equipment. For this reason Hesse GmbH is offering automation concepts individually adapted for every application.



The portfolio of automation components for our machines consists of the following groups:

  • Indexer / Transport system
  • Bonding Station
  • Magazine Lifts
  • Visualization
  • MES Interface

All our machines are suitable for integration into production lines. This also applies to indexers and magazine lifts, which generally communicate to neighbouring systems by SMEMA interface. The customer specific special solutions which differ from the standard, have lead to some extraordinary optional features, such as:

  • Indexer with automatic rail width adjustment
  • Indexer with tilt function for bonding 3-dimensional MID’s
  • Integrated barcode scanner for automatic program selection
  • Indexer with 2 or 3 rails for parallel AUER boat processing
  • Manual heated workholder with adjustable height for maximum flexibility
  • Magazine lifts with capacity for multiple magazines

Bondjet BJ985 Datasheet

PBS200 Datasheet

E-Box Datasheet