Precision
- High precision touchdown detection without time delay
- Precise bondforce control (static and dynamic)
Flexibility
- Largest working area: 305 mm x 410 mm (12″ x 16″)
- Can serve two or more smaller bonding stations for efficient handling of smaller products or substrates,
- elimination indexing time and maximization of throughput (with indexers as well as manual loading)
- Universal software interface for indexer control
- Enables intelligent automation of extra large products
Speed
- Up to 7 wires per second, application-dependent,
- e.g. with parameters25 µm wire, 1 mm loop length, metallized wafer, 127 ms per bond;
- 2 mm loop length, 134 ms per bond
Quality
- Continuous real time monitoring of wire deformation, transducer current, frequency and impedance within programmable control limits
- Piezo bondhead with low maintenance
- Easy connectivity to Hesse Mechatronics` workbench with modules such as process data and backup system PBS200, PiQC, processdatadrain, Secs/Gem or to standard/custom MES (Manufacturing execution systems)
- Process integrated Quality Control (PiQC), detection of other parameters by additional sensors (e.g. friction) for 100% quality monitoring in real time (patented)
- E-Box: patented solution for optimized tool change and programmable alignment marks for wedge and wire clamp
Process Advantages
- Loop length: 70 µm up to 20 mm (2.8 mil – 800 mil), depending on wire diameter
- Various loop form functionsConstant wire length
- Constant loop height
- Individual loop shapes
- Fine Pitch 40 µm inline, 25 µm staggered/dual line (depending on wire and loop)
