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Bondjet BJ955/BJ959

Fully Automatic Heavy Wire Bonder

Bondjets BJ955 and BJ959 of the new bonder generation are ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips and other materials. The systems can be used as a fully automatic machine or operated manually.

Hesse offers the only available solution on the market of handling wires from 50 µm up to 600 µm** with only one bondhead.

The Hesse GmbH, as technology leader, has designed the only heavy wire bondhead with a non-destructive pulltest and a unique transducer integrated sensor for 100% quality monitoring in real-time. Advanced features available on the Bondjet BJ955 and BJ959 are designed to meet your present and future requirements and greatly enhance productivity.

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Bondjet BJ955/959 are characterized by several new features:

  • Optimized pattern recognition
  • Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, …)
  • Hesse Assist Tools: load cell, bondtool and wire spool detection, tool calibration without wedge gauge for operator independency
  • Outstanding features are high speed and the largest bonding area.
  • A change from aluminium to copper can be realized within minutes.

Advanced Features and Process Advantages

  • 50 µm – 600 µm** bondhead for Al, Cu, AlCu (2 mil – 24 mil)
  • Optimized pattern recognition: image capture with new digital image processing and flash
  • Hesse Assist Tools (option):
    • E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
    • Automated bondforce calibration; a load cell prevents operating error and ensures robust processes
    • Innovative bondtool detection
    • Wire spool detection
  • Automated bondtool calibration without wedge gauge
  • Precisely programmable bondforce actuator
  • Loop generator for individual loops
  • Wear-free components with Piezo-Technology
  • Maintenance-free solid state joints
  • Pre-setting of bondheads via EEPROM

Flexibility

  • Working area BJ955: 305 mm x 410 mm (12.0″ x 16.1″)
  • Working area BJ959: 370 mm x 560 mm (14.6″ x 22.0″)
  • Flexible use of the large working area, e.g. vacuum-clamping of several 5″ x 7″ standard DCBs
  • Maximization of throughput by automation (two/more parallel lanes)

Quality

  • Continuous real time monitoring of wire deformation, transducer current and frequency within programmable control limits
  • Process integrated Quality Control PiQC: detection of further parameters by additional sensor system(e.g. friction) for 100% quality monitoring in real time (patented); as option
  • Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % save on equipment
  • Integrated, non-destructive pulltest for wire and ribbon

Heavy wire bondheads

  • Heavy wire and ribbon bondheads for Al, Cu and AlCu
  • An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
  • Wire clamp for loop shape control is standard on all bondheads; optionally equipped with non-destructive pulltest

Various loop form functions

  • Reproducible loop geometry by wire guide appropriate for the material involved and moving wire buffer
  • Constant wire length and loop height
  • Mechanically demanding loop geometrics by parameterization and individual wire clamp application
  • Individual loop shapes by configurable loop trajectory generator

 

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