• Highly flexible, low cost, fully automated pick and place
  • Designed for automatic die sorting from wafer maps, including Multi Project wafers (pizza masks)
  • Easy to set up with DieSort Manager software and expanded wafer map library
  • Fast change to new die size and output medium with pre-leveled output fixtures
  • Flexible platform handling 3 inch to 300mm wafers on many hoop and frame types
  • Picks at programmable heights, speeds and with NSC edge grippers or vacuum pick-up