Highly flexible, low cost, fully automated pick and place
Designed for automatic die sorting from wafer maps, including Multi Project wafers (pizza masks)
Easy to set up with DieSort Manager software and expanded wafer map library
Fast change to new die size and output medium with pre-leveled output fixtures
Flexible platform handling 3 inch to 300mm wafers on many hoop and frame types
Picks at programmable heights, speeds and with NSC edge grippers or vacuum pick-up
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