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7900 Models

Model 7910 Uno

As part of the growing market and the ongoing demand to lower the cost of production per unit (CoO), ADT has responded with a single spindle system model 7910 Uno.

The 7910 Uno system provides a perfect solution for standard silicon wafers up to 8” and for low cost discrete devices.

Further to the automatic vision and easy Graphic User Interface (GUI), ADT is offering a machine at small foot print for saving cost on the production floor.

7910 Series Advantages:

  • Up to 8” wafer
  • Fast automatic alignment and cut positioning increase throughput
  • Automatic Kerf inspection increase yield
  • Automatic Y offset correction ensures maximum precision
  • Single low vibration spindle enable superb cut quality
  • Friendly and intuitive GUI
  • Touch screen user interface
  • Easy to load and unload
  • Easy to maintain
  • Small footprint reduces cost of ownership
  • Price
Model 7132

As part of the growing market of the LED segment and the on going demand to lower the cost of production per unit (CoO), ADT has responded with a dual spindle system model 7900 Duo that double the productivity while maintaining the same current production floor space.

The 7900 Duo system provides a perfect solution for applications that require a long cut cycle time such as image sensors and saw devices.

Further to the automatic vision and easy Graphic User Interface (GUI), ADT is offering a unique feature for processing and programming of broken wafers.

7900 Series Advantages:

  • Two facing spindles enable simultaneous dicing
  • Low vibration platform
  • Fast automatic alignment and cut positioning increase throughput
  • Small footprint reduces cost of ownership
  • Automatic Kerf inspection increase yield
  • Automatic Y offset correction ensures maximum precision
  • Tape surface detection ensures consistent cut quality
  • Touch screen user interface

System Specifications

  • Work piece size: 6″ x 6″ or 8″ x 8″
  • Blade size: 2″- 3″
  • Spindle: Two facing spindle, 60 krpm, 2.5 kW and rated torque of 0.25 Nm

Y1/Y2 Axis

  • Drive: Ball bearing lead screw with stepper motor
  • Control: linear encoder
  • Resolution: 0.2 µm
  • Cumulative accuracy: 1.5 µm
  • Indexing accuracy: 2.0 µm
  • Cutting range: 160mm (6″ x 6″)  /  200mm (8″x8″) 

X Axis

  • Drive: Ball bearing lead screw
  • Air bearing slide
  • Feed rate: up to 600 mm/sec
  • Cutting range: 410mm

Z1/ Z2 Axis

  • Drive: Ball bearing lead screw
  • Resolution: 0.2 µm
  • Accuracy: 2.0 µm
  • Repeatability: 1.0 µm
  • Stroke: up to 25mm

Ø  Axis

  • Drive: closed-loop, direct-drive
  • Accuracy: 4 arc-sec
  • Repeatability: 4 arc-sec
  • Stroke: 350 deg.

Vision System

  • Digital camera, Fire wire link
  • High bright LED illumination (vertical & oblique)

Utilities

  • Electrical: 200-240 VAC 50/60 Hz, Single phase
  • Air consumption: 260 L/min @ 5.5 bar
  • Cutting water (per spindle): 3 L/min
  • Spindle water (per spindle): 1.1 l/min

Dimensions (WxDxH):

  • 875 x 975 x 1450 mm
  • Weight: 900 kg

Features

  • Automatic alignment
  • Automatic Kerf inspection
  • Automatic Y offset correction
Model 7900 Duo LA (Large Area)

7900 Duo LA (LArge Area)

 ADT can provide the 7900 Duo dicing machine with large area cutting capabilities of up to 8” X 10” or 10” X 10”.

The 7900 Duo LA supports multi panels for high throughput.