FlexTRAK™ Plasma Treatment System: The standard configuration to meet the plasma cleaning and plasma treatment requirements of advanced semiconductor and electronic packaging.
FlexTRAK™-S Plasma Treatment System: Specially designed for processing larger substrates, this model has a large-capacity plasma chamber, 9.24 liter, or twice the capacity of a standard FlexTRAK.
FasTRAK™ Plasma Treatment System: Fully-automated, high-throughput, plasma treatment system for lead-frame strips, laminate substrates, and other strip-type microelectronic components. Easy to change over to a new magazine or strip size because recipes are software-driven and the system requires minimal hardware interaction or tooling. Virtually eliminates operator handling of the strips or magazines.
FlexTRAK™ 2MB Plasma Treatment System: Designed for high-throughput, inline processing of microelectronic devices held in boats, trays or other carriers; ideal for pre-Flip-Chip Underfill (FCUF) processes. Unique boat bypass feature optimizes productivity, multiple inline plasma modules and production-ready dual-lane boat handling increase throughput.
FlexTRAK™ CD and FlexTRAK™ CDS Plasma Treatment Systems: Designed for high-throughput processing of lead frame strips, laminated substrates, and other strip-type electronic components. The -CD handles up to 5 strips per plasma cycle and the -CDS, with a longer plasma chamber, handles up to 10 strips per plasma cycle. The operation delivers the parts back into the same magazine; for different handling, refer to the FasTRAK system.