As part of the growing market and the ongoing demand to lower the cost of production per unit (CoO), ADT has responded with a single spindle system model 7910 Uno.
The 7910 Uno system provides a perfect solution for standard silicon wafers up to 8” and for low cost discrete devices.
Further to the automatic vision and easy Graphic User Interface (GUI), ADT is offering a machine at small foot print for saving cost on the production floor.
7910 Series Advantages:
- Up to 8” wafer
- Fast automatic alignment and cut positioning increase throughput
- Automatic Kerf inspection increase yield
- Automatic Y offset correction ensures maximum precision
- Single low vibration spindle enable superb cut quality
- Friendly and intuitive GUI
- Touch screen user interface
- Easy to load and unload
- Easy to maintain
- Small footprint reduces cost of ownership
- Price
As part of the growing market of the LED segment and the on going demand to lower the cost of production per unit (CoO), ADT has responded with a dual spindle system model 7900 Duo that double the productivity while maintaining the same current production floor space.
The 7900 Duo system provides a perfect solution for applications that require a long cut cycle time such as image sensors and saw devices.
Further to the automatic vision and easy Graphic User Interface (GUI), ADT is offering a unique feature for processing and programming of broken wafers.
7900 Series Advantages:
- Two facing spindles enable simultaneous dicing
- Low vibration platform
- Fast automatic alignment and cut positioning increase throughput
- Small footprint reduces cost of ownership
- Automatic Kerf inspection increase yield
- Automatic Y offset correction ensures maximum precision
- Tape surface detection ensures consistent cut quality
- Touch screen user interface
System Specifications
- Work piece size: 6″ x 6″ or 8″ x 8″
- Blade size: 2″- 3″
- Spindle: Two facing spindle, 60 krpm, 2.5 kW and rated torque of 0.25 Nm
Y1/Y2 Axis
- Drive: Ball bearing lead screw with stepper motor
- Control: linear encoder
- Resolution: 0.2 µm
- Cumulative accuracy: 1.5 µm
- Indexing accuracy: 2.0 µm
- Cutting range: 160mm (6″ x 6″) / 200mm (8″x8″)
X Axis
- Drive: Ball bearing lead screw
- Air bearing slide
- Feed rate: up to 600 mm/sec
- Cutting range: 410mm
Z1/ Z2 Axis
- Drive: Ball bearing lead screw
- Resolution: 0.2 µm
- Accuracy: 2.0 µm
- Repeatability: 1.0 µm
- Stroke: up to 25mm
Ø Axis
- Drive: closed-loop, direct-drive
- Accuracy: 4 arc-sec
- Repeatability: 4 arc-sec
- Stroke: 350 deg.
Vision System
- Digital camera, Fire wire link
- High bright LED illumination (vertical & oblique)
Utilities
- Electrical: 200-240 VAC 50/60 Hz, Single phase
- Air consumption: 260 L/min @ 5.5 bar
- Cutting water (per spindle): 3 L/min
- Spindle water (per spindle): 1.1 l/min
Dimensions (WxDxH):
- 875 x 975 x 1450 mm
- Weight: 900 kg
Features
- Automatic alignment
- Automatic Kerf inspection
- Automatic Y offset correction
7900 Duo LA (LArge Area)
ADT can provide the 7900 Duo dicing machine with large area cutting capabilities of up to 8” X 10” or 10” X 10”.
The 7900 Duo LA supports multi panels for high throughput.