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In this remarkable year 2021, our partner GÖPEL electronic celebrates its 30th anniversary! Congratulations to all employees and the management at GÖPEL electronic for an amazing 30 years of success … Read more
If you are looking for a safe way to store and ship your delicate equipment, than our lightweight, high quality product cases might be a solution. The cases are weather … Read more
Advances in Automotive Design and Test for EMC Applications: The Latest Information on Design Strategies and Test Methods Impacting the Future of the Automotive Industry – LIVE Free Webinar Hosted … Read more
This webinar will use real production examples of component and soldering defects to demonstrate the 3D AOI detection capabilities. Goepel electronic will illustrate how “MagicClick” algorithm is used to create … Read more
Recently Yxlon presented the release of new options for the Cheetah and Cougar EVO microfocus X-ray inspection machines. Under the motto ‘Innovation is key to Evolution – Evolution empowers you’, … Read more
Large and small electronics manufacturers continuously need to reduce cost and improve quality. To meet these demands, Goepel electronic has launched two new Automatic Optical Inspection systems. The 3D XE … Read more
Replacing critical devices in e.g. medical imaging, process automation, robotic manufacturing, etc. can be very costly. Therefore repairing the equipment is often the preferred solution and defect printed circuit boards assemblies … Read more
Goepel electronic presents new pre-configured JTAG test and programming solutions. These complete solutions are especially useful for fast verification of electronic prototypes in the laboratory or high mix/low volume assembly … Read more
With “Test Convention connect 2021”, our partner Goepel electronic is launching the digital version of this testing technology event for the first time. No long journeys, no full-day events – … Read more
Bond testing is necessary to evaluate the wire bonding quality and to confirm the consistency and reliability of the bonds in microelectronic assemblies and packages. The test evaluates the integrity … Read more
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