In order to deliver Defect Free Products, Accelonix is promoting a new concept of Design to Delivery flows, by applying the principles of Industry 4.0 as introduced by Aster Technologies: Enhanced Manufacturing Services 4.0 (EMS 4.0).
Micro Electronics Workshop 8th February 2018 in Eindhoven
With the ever increasing integration and miniaturisation in micro electronics assembly and the high demand for short time-to-market products, the need for flexible and cost-effective assembly and inspection solutions is eminent.
TRESKY appointed Accelonix as distributor for their pick-and-place Systems for the Benelux, covering the Netherlands, Belgium and Luxembourg.
We can now offer a series of powerfull bench top Die Bonders, ideal for use in R&D labs, but also usable
A New Bonder for manual or automatic bonding The Bondjet BJ653, with its changeable bond heads, serves the wire bonding processes of wedge-wedge as well as ball-wedge and can handle fine wire, heavy wire and ribbon.