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TPT HB10

The TPT HB10 Semi-Automatic series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.

An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.

The HB10 series also benefits from a motorised Z axis giving more control over the looping of the wire.

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