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The TPT HB10 Semi-Automatic series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.

An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.

The HB10 series also benefits from a motorised Z axis giving more control over the looping of the wire.

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Gold, aluminium, silver & copper wire Wedge, ball & ribbon bonding 6.5″ Touch Panel
Automatic bond height adjustment Storage of 100 parameters Deep & wide bond access
Motorised Wire Clamp Motorised Wire Spool Extension Kit compatibility
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  • Gold Wire Diameter 17-75µ (0.7 – 3 mil)
  • Aluminium Wire Diameter 17-75µ (0.7 – 3mil)
  • Ribbon Size up to 25×250µ (1×8 mil)
  • 62kHz Transducer PLL Control
  • Ultrasonic Power 0-5 Watt Output
  • Bond Time 0-10 seconds
  • Bond Force 5-150cNm (350cNm option)
  • 90° Wire Feed Angle
  • 17mm Z Travel
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TPT HB10 Datasheet

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