TPT HB05 Manual Wire Bonder
The HB05 manual series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.
An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.
Our HB05 gives you an easy access to the topic of bonding.
Look, aim, bond – done.
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Manual Wire Bonder
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17μm to 75μm Wire gold, aluminum, silver |
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One Bond Head wedge, ball, bump |
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Light Weight weighs in total |
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Compact Design smooth and |
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4“ TFT
fast and easy control of |
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Storage of 20 parameters aasy setting recall for working |
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Deep & Wide Bond Access ample workspace due to |
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Motorized Wire Clamp precise tail length control |
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Extension Kits Pick & Place Kit, Pulltester, |
- Gold Wire Diameter 17-75µ (0.7 – 3 mil)
- Aluminium Wire Diameter 17-75µ (0.7 – 3mil)
- Ribbon Size up to 25×250µ (1×8 mil)
- 63,3 kHz Transducer PLL Control
- Ultrasonic Power 0-10 Watt Output
- Bond Time 0-1 seconds
- Bond Force 5-130cNm (350cNm option)
- 90° Wire Feed Angle
- Build-in Temperature controller
TPT HB05 Datasheet 
