Hesse BJ955/BJ959

Bondjet BJ955/959 are characterized by several new features:

• Optimized pattern recognition
• Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, …)
• Hesse Assist Tools: load cell, bondtool and wire spool detection, tool calibration without wedge gauge for operator independency
• Outstanding features are high speed and the largest bonding area.
• A change from aluminium to copper can be realized within minutes.

Advanced Features and Process Advantages

• 50 µm – 600 µm** bondhead for Al, Cu, AlCu (2 mil – 24 mil)
• Optimized pattern recognition: image capture with new digital image processing and flash
• Hesse Assist Tools (option):
  • E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
  • Automated bondforce calibration; a load cell prevents operating error and ensures robust processes
  • Innovative bondtool detection
  • Wire spool detection
• Automated bondtool calibration without wedge gauge
• Precisely programmable bondforce actuator
• Loop generator for individual loops
• Wear-free components with Piezo-Technology
• Maintenance-free solid state joints
• Pre-setting of bondheads via EEPROM

Flexibility

• Working area BJ955: 305 mm x 410 mm (12.0″ x 16.1″)
• Working area BJ959: 370 mm x 560 mm (14.6″ x 22.0″)
• Flexible use of the large working area, e.g. vacuum-clamping of several 5″ x 7″ standard DCBs
• Maximization of throughput by automation (two/more parallel lanes)

Quality

• Continuous real time monitoring of wire deformation, transducer current and frequency within programmable control limits
• Process integrated Quality Control PiQC: detection of further parameters by additional sensor system(e.g. friction) for 100% quality monitoring in real time (patented); as option
• Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % save on equipment
• Integrated, non-destructive pulltest for wire and ribbon

Heavy wire bondheads

• Heavy wire and ribbon bondheads for Al, Cu and AlCu
• An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
• Wire clamp for loop shape control is standard on all bondheads; optionally equipped with non-destructive pulltest

Various loop form functions

• Reproducible loop geometry by wire guide appropriate for the material involved and moving wire buffer
• Constant wire length and loop height
• Mechanically demanding loop geometrics by parameterization and individual wire clamp application
• Individual loop shapes by configurable loop trajectory generator