TPT HB100 Automatic Wire Bonder
The HB100 represents a new generation of automatic desktop wire bonder with motorised Z-X-Y axis, bondhead rotation and pattern recognition.
- Perfectly suited for laboratories and small volume productions.
- This versatile machine can perform wedge and ball bonding with a single bond head.
- With fast, precise linear motor axis, the HB100 is very easy to use and packed with exciting features such as a touch-screen, dual camera system and joystick control.
- In addition, the latest software technology supports the user with process guidance and bond assist features.
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Automatic Wire Bonder
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Automatic Wire Bonder |
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Pattern recognition |  |
Wedge, ball & ribbon bonding |
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21″ Touch Panel |  |
Automatic bond height adjustment |  |
Simple Loop Programming |
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Repeatable Loop Profiles |  |
Deep & wide access |  |
Motorised Wire Clamp |
- Gold & Aluminium Wire Diameter 17-75µ (0.7 – 3 mil)
- Ribbon Size up to 25×250µ (1×8 mil)
- X-Y Drive & Resolution linear motors 0.1µ
- 63.3kHz Transducer PLL Control (110kHz option)
- Ultrasonic Power 0-10 Watt Output
- Bond Time 0-5 seconds
- Bond Force 10-200cNm
- 90° Wire Feed Angle
- 100mm Motorized Z travel
- Motorized X, Y, Z and Theta axis
- Loop Profile Software with up to 10 steps
- Intuitive 21″ Interface with Touch Screen Control
- Simple change between Ball and Wedge Bonding
- Deep Access Bondhead
- Dual Camera System for Detail view and Overview at the same time
- Crash Prevention System for Z-Axis Touch Down
- Parameters Entered using Real Units of Force, Time and Power
- Broad range of Accessories like Heater stages and Top Platesb
TPT HB100 Datasheet 
