Tuesday May 28th, 2024 – Eindhoven
📢 You’re Invited! Join us on May 28th at the Accelonix Office in Eindhoven for an exciting workshop! Are your interested to learn more about the latest developments and practices in Dispensing Die and Wire bond for Micro and Power electronics Assembly? Do you want to network with experts and peers in Micro and Powerelectronics assembly? If so then join us for this exiting Tech Day Full of presentations and machine demonstrations on May 28th, 2024 in Eindhoven. 🔹 Main Topic: Introduction of Musashi Engineering Dispensing Solutions 👨💼 Presentation by Mr. Kaoru Okuyama 🔧 Live Demonstration: Musashi Dispensing Solutions 🔹 Special Presentation: 🎤 Tresky Automation Sales Engineer 🔧 Topic: Introduction to Die Bonding Technologies for Micro and Power Assembly. 🔹 Guest Presentation: 👨💼 Mr. Jochen Schuermans from Roartis BVBA (IQ-BOND) 🔍 Topic: Dispensing Materials – Die Attach Glues & Epoxy, Underfill, Gloptop, Potting, UV, Sinter Paste, etc,  🔹 Live Equipment Demonstrations: 🔧 Dispensing : 🔹Musashi XM350 Desktop Dispensing Robot 🔹Dispensers ⚡ Wire Bonding: 🔹TPT HB05 🔹TPT HB16 🔹TPT HB30 ⛓️ Quality Assurance: 🔹Royce 620 Bondtester 🔹YXLON Cheetah X-Ray & CT  The Tech Day is aimed at anyone who is involved or has interest in Micro or Power Electronics Assembly. Don’t miss this opportunity to explore cutting-edge technologies and gain valuable insights. Reserve your spots now.The Tech Day and lunch are free of charge, but registration is required. To register, please visit our website and fill out the online form. The deadline for registration is May 22, 2024. The number of seats is limited, so don’t miss this opportunity. We look forward to meet you at the “Tech Day: Micro & Power Electronics Assembly” in Eindhoven. |
