| 📢 You’re Invited! Join us on March 25 at Accelonix in Eindhoven for an exciting Tech Day! Accelonix Benelux invites you to our exclusive Technology Day, dedicated to microelectronic assembly of small dies. This event is a unique opportunity to discover the latest technologies and tips for Epoxy Adhesive Die Bonding and Wire Bonding of the smallest Dies and components. 📅 Date: 25-03-2025 📍 Location: Accelonix Benelux, Luchthavenweg 18b, Eindhoven 🕘 Time: 09:30h – 15:30h 🔹 What to Expect? Throughout the day, industry experts will present cutting-edge insights and perform live demonstrations of advanced technology solutions for micro electronics assembly of small components. Program & Live Demonstrations: ✔️ Musashi Engineering – Dispensing Solutions Topic: Dispensing Systems, Pumps and consumable selection optimal for small micro dispensing. Live Demo: Musashi XM350 Desktop Dispensing System with coating and jetting valve ✔️ Tresky AG / Tresky Automation – Die Bonding Topic: Die Bonding machines and Pick-tool selection optimal for small or large microchips, Live Demo: Tresky T-4909-AE ✔️ Hesse Mechatronics / TPT Wire Bonder / Deweyl – Wire Bonding Topic: Wire Bonding machines and Deweyl wedge tool selection optimal for smallest wire bonding pads. Live Demo: Hesse BJ653 / TPT HB16 |
| 🔹 Live Equipment Demonstrations: 🔧 Dispensing Robots Musashi: 🔹Musashi XM350 Desktop Dispensing Robot 🔹Shotmaster SX 🔧 Dispensing Pumps Musashi: 🔹Aerojet 🔹ML-6000X 🔧 Die Bonder Tresky AG: 🔹Tresky T-4909-AE ⚡ Wire Bonding: 🔹Hesse BJ653 🔹TPT HB16 🔹TPT HB30 ⛓️ Quality Assurance: 🔹Royce 620 Bondtester 🔹YXLON Cheetah X-Ray & CT 🎟 Register Now: Secure your spot today! |
