Fully Automatic Heavy Wire Wedge Bonder with a large working area
Bondjets BJ985 belongs to the new generation of ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips, automotive applications (e.g. batteries) and other materials. It can be used as a fully automatic machine or operated manually.
Hesse offers the only available solution on the market of handling wires from 50 µm up to 600 µm** with only one bondhead.
Hesse GmbH, as technology leader, has designed the only heavy wire bondhead with a non destructive pulltest and a unique transducer integrated sensor for 100 % quality monitoring in real time.
A bondhead change from aluminium to copper can be realized within minutes. In addition to a standard configuration Hesse off ers automation concepts individually adapted for every application.
Bondjet BJ985 is characterized by several new features:
Optimized pattern recognition (PR)
Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, …)
Hesse Assist Tools: load cell, bondtool and wire spool detection, tool calibration without wedge gauge for operator independency
Outstanding features of the new Bondjet BJ985 are the large bonding area of 370 mm x 870 mm, a high drive through and high speed
Advanced Features and Process Advantages
50 µm – 600 µm** bondhead for Al, Cu, AlCu (2 mil – 24 mil)
Improved wire handling: short distance between bondhead and spool
Optimized pattern recognition: image capture with new digital image processing and flash
Hesse Assist Tools (option):
E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
Automated bondforce calibration; a load cell prevents operating error and ensures robust processes
Innovative bondtool detection
Wire spool detection
Automated bondtool calibration without wedge gauge
Precisely programmable bondforce actuator
Loop generator for individual loops
Wear-free components with Piezo-Technology
Maintenance-free solid state joints
Pre-setting of bondheads via EEPROM
Flexibility
Working area BJ985: 370 mm x 870 mm (14.6″ x 34.3″)
Flexible use of the large working area, e.g. vacuum-clamping of several 5″ x 7″ standard DCBs
Maximization of throughput by automation (two/more parallel lanes)
Quality
Continuous real time monitoring of wire deformation, transducer current and frequency within programmable control limits
Process integrated Quality Control PiQC: detection of further parameters by additional sensor system(e.g. friction) for 100% quality monitoring in real time (patented); as option
Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % save on equipment
Integrated, non-destructive pulltest for wire and ribbon
Heavy wire bondheads
Heavy wire and ribbon bondheads for Al, Cu and AlCu
An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
Wire clamp for loop shape control is standard on all bondheads; optionally equipped with non-destructive pulltest
Various loop form functions
Reproducible loop geometry by wire guide appropriate for the material involved and moving wire buffer
Constant wire length and loop height
Mechanically demanding loop geometrics by parameterization and individual wire clamp application
Individual loop shapes by configurable loop trajectory generator
Working area
BJ985: X: 370 mm (14.6″); Y: 870 mm (34.3″); Z: 42 mm (1.65″)
P-rotation: 440°
Cutting methods
active, passive, air cut (for frontcut)
Ultrasonics
Digital ultrasonic generator with PLL (Phase Locked Loop), internal frequency resolution <1 Hz
Programmable ultrasonic power output
Wire
Al, Cu, AlCu: 50 µm – 600 µm** (2 mil – 24 mil)
Ribbon
Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm** (Cu: 200 µm) (10 mil x 1 mil up to 80 mil x 16 mil)
Machine dimensions
BJ985: 1361 mm x 2144 mm x 1920 mm (53.6″ x 84.4″ x 75.6″), appr. 1750 kg
Wire: 250 µm x 25 µm up to 2000 µm x 400 µm** (Cu: 200 µm)
(10 mil x 1 mil up to 80 mil x 16 mil)
Bonding force adjustable
Wedge length: 2.622″
Heavy Wire Bondhead RBK Copper
Type Copper: RBK Froncut, Backcut
Transducer (bond frequency): 60 kHz*
Wire: Cu : 50 µm – 600 µm** (2 mil – 24 mil)
Bonding force adjustable
Wedge length: 2.733″
E-Box
E-Box
E-Box
Adjustment tool for wire bonders
The E-Box of the Hesse GmbH is a patent-registered visualisation system for control supported, reproducible adjustments of bondhead elements. It includes a camera for optical displaying of wedge, cutter and wire guide as well as a graphical support for adjustment- and positioning control. E-Box allows significant time reduction for setting up the machine. Software enhanced optical adjustment system for wedge, cutter and wire guide / wire clamp.
E-Box for Bonder – Advantages during Production
Better reproducibility of the adjustment depending attributes (e.g. loop forming) after change of wearing parts
Longer life time of wearing parts
Advantages for Bond Process
System for reproducible set-up of wedge, cutter and wire guide / wire clamp
Set-up without microscope
Free programmable, specified positions for bondhead elements
shown as limitation line
different views selectable (different sides, bottom, front etc.)
Minimizes time expenditure for set-up work, set-up control and readjustment
Process secured adjustment of wire feed elements (wedge, wire clamp, wire guide, cutter etc.)
Graphical supported, visual control of
wedge and wire guide position
distance between wedge and wire clamp
gap of wire clamp
wire pass
cutter respectively cutting position
Process integrated Quality Control system PiQC
The Hesse GmbH has implemented a new Process integrated Quality Control system (PiQC) that is unique to the global wire bonding market. A sensor integrated into the Transducer allows for the first time a multi-dimensional signal analysis of the bond process. PiQC calculates a bond quality index value in realtime, using significant signals from the wire-bonding process.
Advantages for volume production
Inspection of every bond
No mechanical load of the bond connection
Product specific configuration of the quality control system
Feedback from the process
Mechanical oscillation of the wedge
Friction at bond surface
Transducer current
Ultrasonic frequency progression
Wire deformation
Quality statements by PiQC
PiQC calculates a quality index for each bond based on the actual feedback signal from the process
The signal related components of the quality index can be displayed graphically at any time
Teach mode for reference data
Detailed automatic analysis of the welding process
Extraction of process-specific reference data
Software Options
Software Options
Hesse Bonder Network (HBN): complete line management, synchronization of data, easy integration of new machines via Plug & Produce, no server necessary
PBS Server & Workbench 2.0: central data management, line management, automatic backup system, remote pattern recognition
TwinCAT® Automation: integration of control software for automation in Hesse Bonder Interface
SECS/GEM: integrated standardized server connection for automation and communication, handling via Workbench
MES: interface to Manufacturing Execution Systems, integrated or customized implementation
CSV-Logger: storage of all machine and process data, e.g. bond positions etc.
Login via USB stick
PBS200 - Wire Bonder Server
The PBS200 Wire Bonder Server is a Windows based system to connect up to 20 Hesse Mechatronics wire bonders at your factory. You can supervise and administrate the machines while production is running. With PBS200 you will have perfect integration of your wire bonders in the production system. The wire bonders communicate with PBS200 Server over the powerful XML based PBS network protocol.
Features of PBS200
Backup all the data of all connected wire bonders
User Administration and assignment of user accounts to wire bonders or production lines
Process Data in real time, ability to store the process data you need and import in Microsoft Excel (Option)
Masterprogramming
Customization PBS200 can be enhanced according to specific customer requirements for traceability or an MES Server connection (Option). Allow the MES system to decide, what process program is used, store the process results in your MES system. Implement your rework strategy on the Wire Bonders
SECS/GEM – compliant module is available for PBS200 (Option)
Multi Server: Run multiple PBS200 Servers and administrate all with the PBS Workbench in your office
PBS200 includes
PBS200 Client license for one wire bonder
PBS200 Hardware with Windows 7 Professional™ and 2 network adaptors
PBS200 Server license for one server
PBS & PiQC Workbench with USB stick license key
Available Process Data
Logbook Data
Machine Configuration
Important Program Parameters
Device ID and Bond Position
PiQC Quality Values
Deformation and Current Charts
Material and Tool Counters
Statistical Data
Automation
The precise and safe handling of the products in and out of the production machine plays a significant role in controlling the product quality, yield and efficiency of the production equipment. For this reason Hesse GmbH is offering automation concepts individually adapted for every application.
The portfolio of automation components for our machines consists of the following groups:
Indexer / Transport system
Bonding Station
Magazine Lifts
Visualization
MES Interface
All our machines are suitable for integration into production lines. This also applies to indexers and magazine lifts, which generally communicate to neighbouring systems by SMEMA interface. The customer specific special solutions which differ from the standard, have lead to some extraordinary optional features, such as:
Indexer with automatic rail width adjustment
Indexer with tilt function for bonding 3-dimensional MID’s
Integrated barcode scanner for automatic program selection
Indexer with 2 or 3 rails for parallel AUER boat processing
Manual heated workholder with adjustable height for maximum flexibility
Magazine lifts with capacity for multiple magazines
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