+31 40 7501650

ADT 8020 Series

Fully Automatic Twin Dicing System

The ADT 8020 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput.

ADT 8020 is a high accuracy system that can dice workpieces of up to 8-inch in diameter, at high performances and low cost of operation

Ease of Use

The 8020 operates with the ADT intuitive New graphic User Interface (NUI), and includes two touch-screens: a 19” monitor for the main screen and a 17” monitor maintenance screen.
The maintenance screen assists with performing system setup procedures, blade change and some basic maintenance operations.

Leading Applications:  

  • Silicon wafers / discrete devices
  • Silicon carbide (SiC)
  • MEMS
  • SAW devices
  • Glass wafer
  • Packaging (QFN, LED…)

Features and Benefits  

  • Flexibility – Supports Hub and Hubless blades up to 3″ O.D.
  • Spindles of 1.8 kW or 2.4 kW high power (for challenging applications)
  • Superior vision system with continuous zoom magnification
  • Intuitive operation interface using a large 19” touch screen monitor

Other Key Features

  •  Air bearing feed axis (X)
  • Fast automatic alignment and cut positioning for increased throughput
  • Automatic Kerf inspection and quality analysis for maximum precision
  • Process data logging and statistical analysis
  • Fast & Simple Blade Change with a locking spindle shaft
  • SECS/GEM platform ready
  • Full access to all areas of the system for convenient and easy maintenance

ADT 8020 Series Datasheet