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ADT 8020 Series

Fully Automatic Twin Dicing System

The ADT 8020 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput.

ADT 8020 is a high accuracy system that can dice workpieces of up to 8-inch in diameter, at high performances and low cost of operation

Description

Ease of Use

The 8020 operates with the ADT intuitive New graphic User Interface (NUI), and includes two touch-screens: a 19” monitor for the main screen and a 17” monitor maintenance screen.
The maintenance screen assists with performing system setup procedures, blade change and some basic maintenance operations.

Leading Applications:  

  • Silicon wafers / discrete devices
  • Silicon carbide (SiC)
  • MEMS
  • SAW devices
  • Glass wafer
  • Packaging (QFN, LED…)

Features and Benefits  

  • Flexibility – Supports Hub and Hubless blades up to 3″ O.D.
  • Spindles of 1.8 kW or 2.4 kW high power (for challenging applications)
  • Superior vision system with continuous zoom magnification
  • Intuitive operation interface using a large 19” touch screen monitor

Other Key Features

  •  Air bearing feed axis (X)
  • Fast automatic alignment and cut positioning for increased throughput
  • Automatic Kerf inspection and quality analysis for maximum precision
  • Process data logging and statistical analysis
  • Fast & Simple Blade Change with a locking spindle shaft
  • SECS/GEM platform ready
  • Full access to all areas of the system for convenient and easy maintenance

ADT 8020 Series Datasheet