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Wafer Cleaner 977

ADT 977 Wafer Cleaner Systems are designed for cleaning workpieces after dicing.

Efficient compact cleaning units to support your process

The systems are offered in three basic configurations :

  • WCS-977 –  round wafer up to 8″
  • WCS-977LA –  round wafer up to 12″
  • WCS-977D –  a standalone coating/de-coating station with:
    *Wafer spin coating technology
    *Absolute surface protection during dicing
    *100% removal of contamination and residue
    *Atomized cleaning and N2 drying

Description

977 System Highlights :

  • Atomizing cleaning
  • Automatic lid closing
  • Intuitive control panel
  • Process monitoring
  • Compact design
  • Robust, vibration free
  • Environmentally friendly

Options:

  • Build-in mist exhaust unit
  • CO2 injection
  • Customized chucks
  • Cleaning additives
  977- 200 977L – 300
Max. wafer size Ø 200 mm Ø 300 mm
Cleaning method

Atomizing cleaning/

High pressure cleaning

Atomizing cleaning/

High pressure cleaning

Number of recipes that can be saved 8 8
Spinner velocity range 200–3000 rpm 200–2500 rpm
Machine dimensions (WxDxH) 410 x 625 x 950 mm 520 x 809 x 950 mm
Approx. machine weight 100 kg 160 kg

 

ADT Wafer Cleaner Brochure

ADT Peripheral Equipments