The 7120 / 7130 Series Dicing Systems offer a wide range of advanced automation and process monitoring options to meet the requirements of your most challenging dicing applications:
- Ceramic Substrates & Capacitors
- Glass
- Automotive Sensors
- PZT
- Glass on Silicon
- LED & LED on PCB Packages
- Package Singulation (BGA & QFN)
- Opto-electronic Components
- SAW Filters
- Sensors & MEMS
- LTCC
- IC Wafers
7120 / 7130 Series Features & Options:
- Extra Large Area Dicing (7100 XLA)
- Large Area
- Tilting Spindle
- Dressing Station for diamonds exposure and clogging prevention
7120 / 7130 Series Advantages
- 2” and 4” spindle dicing systems
- A full range of automatic vision capabilities
- Advanced hardware platform for high reliability and low maintenance
- Heavy Duty, cast-iron base structure for superior precision and accuracy
- Increased yield, throughput and process control
- Unique multi-panel processing capabilities
- Special blade wear forecast algorithm
- User-friendly software platform