Fine Wire Bonders
The Hesse and TPT Automatic Fine Wire Bonders are ultrasonic wire bonders developed for the fully automated processing of a wide range of substrates, chips, batterypacks, solar panels and many other materials.
These system can typically handle wires from 12.5 µm – 75 µm (Ribbons up to 250 µm x 25 µm.)
Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics.
