Full 3D AOI solutions for SMT and THT Assembly Powered by AI Technology |
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Since many years our partner Goepel Electronics is a pioneer in innovating the AOI technology for SMT and THT assembly of elecronic products. In our current era with short time to market, difficulties in component provisioning and shortage of experienced workforce it is key to rely on manufacturing and inspection solutions that are flexible, easy to use and provide first time right results. At the SMTconnect in Nuremberg from 9 to 11 May, Goepel will showcase their systems and software. Also Accelonix will be present on 9 and 10 May. Visit us at booth 222 in hall 4A. Contact us for a free entrance! Discover here below our solutions for full 3D inspection of solder paste, SMT- and THT components and solders, plus read what our customers have to say!
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SPI – Line 3D : Inspection of Solder and Sinter Paste Deposition | ||
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VARIO – Line 3D : Inspection of SMT Assemblies | ||
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BASIC – Line 3D : Stand-alone Inspection of SMT Assemblies and Solder Paste | ||
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THT – Line 3D: Inspection of THT Assemblies and Solder Joints | ||
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What our Goepel AOI Users have to say | ||
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Copyright 2023 Accelonix BV – Luchthavenweg 18-b Eindhoven, NL-5657 EB – www.accelonix.nl Your comments, questions, and suggestions are welcome via e-mail to sales@accelonix.nl |