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SPI Line 3D

3D Paste Inspection

In-line solder paste inspection system, SPI Line 3D.
For fast inspection of solder and sinter paste.
Conventional solder paste with a height of 80 μm to 150 μm can be measured just as well as sinter pastes with a height of only 20 μm.
The system is available in various resolution configurations.

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3D Paste Inspection

The inline inspection system for printed solder paste is characterized by a wide measuring range. Conventional solder pastes with a height of 80 μm to 150 μm can be measured just as well as sinter pastes with a height of only 20 μm. The system is available in various resolution configurations.

The solder paste depots are inspected according to the criteria of shape, height, area, bridges, volume, x/y offset and coplanarity.

The sinter paste inspection also includes the detection of particles, notches, holes and frayings in the depot.

The SPI system is essential for prevention of soldering errors:

  • Early fault detection
    • detection of paste deposition defects
    • assemblies with detected solder paste defects sorted out after paste printing
  • Monitoring of stencil printing
    • correct position of the solder paste depot
    • measures the deposit volumes and volume distribution
  • Camera head optimised for speed
  • 180 images per second at 4 megapixel resolution
  • Highly precise 3D image capturing based
  • Double-sided projection for 100% shadow-free measurement
  • Measuring paste heights from 20 µm
  • PILOT SPI – user software
  • Touchscreen interface
  • Generation of test programs in less than 10 minutes via SPI Wizard
  • Closed loop to paste printer
  • Data connection with AOI/AXI on a combined repair station

Goepel SPI Line 3D Datasheet 
Goepel Pilot AOI Datasheet 
Goepel Inspection Systems Brochure