The THT Line 3D is an AOI system for the inspection of THT components, THT solder joints and wave soldered SMD components in a single system.
With up to 8 angled view cameras, concealed components and lateral markings can also be inspected. The inline system inspects THT and SMD components from the top.
A 3D camera module below the conveyor belt simultaneously and independently performs a 3D inspection of the THT solder joints and pins. This allows solder volume, solder flow and pin height to be precisely measured and defects reliably detected.
The THT Line 3D can now also inspect both the top and bottom of the assembly simultaneously in 3D.
An additional 3D AOI module in the system makes this possible.
As a result, it is possible, for example, to inspect selective solder joints on both sides of the assembly at the same time and to measure the solder volume and the pin length with the 3D method.
The automatic or manual feeding of assemblies can be performed out with or without workpiece carriers. Thanks to a height-adjustable camera module, the THT Line · 3D allows a component clearance of up to 140 mm.
The AOI system features Goepel PILOT AOI user software and integrates to Goepel PILOT CONNECT for integration with MES and database systems to centralize all inspection and machine data.