TPT HB16 Semi-Automatic Wire Bonder
The HB16 Semi-Automatic series bench top size wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.
An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.
The HB16 series also benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease.
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Semi-Automatic Wire Bonder
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Gold, aluminium, silver & copper wire |  |
Wedge, ball & ribbon bonding |  |
Repeatable Loop Profiles |
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6.5″ Touch Panel |  |
Automatic bond height adjustment |  |
Simple Loop Programming |
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Storage of 100 parameters |  |
Deep & wide access |  |
Motorised Wire Clamp |
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Motorised Wire Spool |  |
Extension Kit compatibility |
- Gold Wire Diameter 17-75µ (0.7 – 3 mil)
- Aluminium Wire Diameter 17-75µ (0.7 – 3mil)
- Ribbon Size up to 25×250µ (1×8 mil)
- 62kHz Transducer PLL Control
- Ultrasonic Power 0-5 Watt Output
- Bond Time 0-10 seconds
- Bond Force 5-150cNm (350cNm option)
- 90° Wire Feed Angle
- 17mm Z Travel
TPT HB16 Datasheet 
